Offset printing is one of the main printing methods, with the development of UVLED light curing technology, UVLED curing system gradually replaced the traditional UV curing, at present, there are also printing plants for offset printing press installed UVLED curing system. Why can UVLED curing system replace mercury lamp? The service life of mercury lamp is short, generally about 1000 hours. Mercu...

UV debonding, also known asaviolet (UV) debonding, is a technology based on UV irradiation and chemical reactions used for curing or debonding adhesives, coatings, inks, and other materials. The principle involves the use of a photoinitiator and UV irradiation. 1. Photoinitiator: A photoinitiator is a chemical substance that absorbs UV light and undergoes a chemical reaction, generating free radic...

A 12-inch manual Wafer Expander machine is a device used for expanding or stretching various materials. It is operated manually and features a 12-inch width, which determines the maximum size of the material it can accommodate. The machine is designed to provide controlled and uniform stretching to achieve desired results. Manual 12-inch wafer Expander manufacturer manufacturer:leduvcuring.com The...

Both the UV tape and blue film are viscous, and their viscosity is expressed by the viscous peel degree, usually N/20 mm or N/25 mm. For example, the meaning of 1 N/20 mm is that the width of the test strip is 20 mm, and the force to peel it off from the test version with a 180° peel Angle is 1 N. UV film is a special formulation of coating on the surface of PET film substrate, to achieve the effe...

Before the wafer is thinned, a sticky film is attached to the front of the wafer. The role of the film is to secure the chip on the front of the wafer, which is easy for the grinding machine to grind on the back of the wafer. Generally, the thickness of the silicon wafer before grinding is about 700 μm, and after grinding, the thickness of the wafer becomes 200 μm, or even 120 μm. The wafer thinni...

parameter Model: NVSU233C-D4 Peak wavelength 365nm Forward current: 1400mA Power: 5.88W Voltage: 3.6-4V Radiation flux:>1450mW/cm2 Lens material: quartz glass Lens angle: 60 degrees Size: 3.5X3.5mm Application field: The most commonly used areas are UV curing and bonding. UV glue and UV ink curing. The applicable devices are UV LED point light sources, UV LED line light sources, and UV LED surf...

Generally, 2 to 3 UV lamps are installed in the middle part of the paper receiving chain rail, and an exhaust pipe is installed at the top of the paper receiving part, and a UV curing device can also be separately connected, and the conveyor belt is connected to the paper receiving table part. Obviously, the latter, due to the limitation of the conveyor belt speed of the UV curing device, will aff...

Are 0.25mm wafers thin or thick? How thin or how thick is suitable for a wafer? How is it divided? A 0.25mm wafer can be considered a thin wafer, but it is not really a thin wafer. The thickness of wafers varies according to application requirements. Generally, wafers less than or equal to 100μm (0.1mm) can be considered thin, and wafers greater than 100μm can be considered thick. In engineering a...