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Custom 4-inch Wafer Film & Gold Layer Peeling MachineCustom 4-inch Wafer Film & Gold Layer Peeling Machine is designed for precise and efficient wafer film and gold layer peeling, featuring stable operation and high processing accuracy for semiconductor applications. We support OEM/ODM customization and tailored machine solutions according to different production requirements, helping customers improve efficiency and maintain consistent product quality. -
12 inch Semi-automatic Film Wafer Laminating MachineThe 12 Inch Semi-automatic Film Wafer Laminating Machine featuresheight adjustment, table heating, vacuum adsorption, and automatic film sticking, ensuring precise and stable lamination for semiconductor wafers. Its advanced design improves lamination accuracy and production efficiency while maintaining consistent performance. Withover 2000 successful cases, the machine has proven reliability and is widely trusted in wafer processing applications. -
DSXUV 6 inch Frame Film Manual Wafer Tearing Film Machine With Ceramic ChuckThe DSXUV 6 inch frame film manual wafer tearing machine is equipped with a high-precision ceramic chuck to ensure stable wafer fixation during operation. Designed for manual film tearing, it offers reliable performance and precise control. This machine is suitable for semiconductor wafer processing and packaging applications. -
Standard 12-inch wafer laminator Direct with in-stock itemsCustomizable 12-inch Vacuum Wafer Mounter, Bubble/Wrinkle-free with Precision Mounting. Suitable for semiconductor manufacturing lines requiring reliable handling consistency and easy operation. -
QFN 12 inch Semi-automatic Wafer Laminating Machine for Square Frame Ring CustomizedRoller system, Micrometer to adjust thickness, Adjustable pressure, Vacuum heating function, Servo motor 400W -
American LEDCure EIT Energy Meter Four Channel Four Band Professional TestingFour-band monitoring is available with L-365,L-385,L-395 and L-405 responsesnergy Density (/cm2) -
Blue Film Stretch Machine Wafer laminating MachineManual or Semi-automatic, Uniform membrane expansion, tension control,Support disco iron rings -
200x200mm Semi automatic UV Curing Box Tape Uv Curing SystemThe cooling method is air cooling, Time and illumination can be adjusted, The curing area of this machine is 200*200mm. Accept customization. -
Uniform Light Collimating Lens LED Uniform Light Variable Zoom OpticsUniversal use of various flat chips,Spot illumination uniformity reaches 90%,Require to ensure that the chip installation positioning deviation is less than 0.03 -
Ceramic Substrate Laminating Machine Vacuum Heating Platform DPC Wafer MounterHeating platform, Adjustable chuck table, Temperature 0-100 degrees, No bubbles, No burrs
+8618924372460
live:1651063690jennifer
uvcure@uvspacelight.com
0086-18924372460