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Manual Wafer Film Separator Silicon Stripping Machine Manual Wafer Film Separator Silicon Stripping Machine Manual Wafer Film Separator Silicon Stripping Machine

Manual Wafer Film Separator Silicon Stripping Machine

This film tearing machine is used to remove the protective tape on the surface of wafers after thinning or etching processes. The device can be used for film tearing on 4 ", 5", 6 ", 8", and 12 "wafers.
  • model no. :

    DSXUV-8INCH
  • port of dispatch :

    Shenzhen
  • Payment :

    T/T 100% before shipment
  • original region :

    China
  • Lead Time :

    15-20days
Product Details
Product features:
1. The workbench has heating and vacuum functions, and an imported temperature control system, which ensures stable equipment performance and convenient and fast operation
2. The device can be used for film tearing on 4 ", 5", 6 ", 8", and 12 "wafers
3. The anti-static PTFE treated working disc can effectively protect the wafer chip

Specifications:
Wafer type: Silicon wafer /s gallium arsenide/Glass substrate
Membrane species: Blue film/uv film after gluing
Mode of operation: The wafer is placed and removed manually
Purpose: It is specially used for the film tearing process of wafer packaging
Separator Silicon Stripping Machine
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