-
250x250mm UVA 365nm UV LED Curing Systems for Degumming250mmX250mm UV band 365nm ungluing machine UV LED Curing Systems is a kind of equipment used for glass ungluing, UV tape degumming
-
Nitrogen Type Semiautomatic 8inch UV Tape UV LED Curing Systems8inch UV Tape UV LED Curing Systems is a device for removing the UV tape of wafer.
-
Standard Nitrogen 12 inch UV Tape UV Curing Systems Machine12 inch Wafer Tape Degumming Machine is suitable for degumming wafer, silicon wafer, glass, semiconductor components and other products.
-
12inch UV Tape Curing Systems with Touch Screen Operation Systems12inch Wafer Film UV Curing Systems is widely used in degumming wafers, like silicon wafers, glass and semiconductor components.
-
Standard 8 inch UV Tape UV Curing Systems for Wafer SemiconductorStandard 8inch UV Wafer Tape Curing System reduce the tape stickness, facilitating the next operation.
-
Clamshell 500*500mm UV Tape UV Curing Systems Reducing Blue Film ViscosityAdhesive strength becomes lower when UV(Ultraviolet light) is irradiated by UV Tape UV Curing Systems.
-
8 inches Mercury Lamp UV Tape UV Curing Systems Reciprocating Conveyor Belt UV Curing Light Source8 inch UV Tape Curing Systems reduce the adhesive strength of all UV-sensitive dicing tapes under controlled environment
-
12 inches UV Tape UV Curing System Machine Separated UV Film from Wafer Chip6/8/12 inches UV Tape UV Curing Systems is with high efficiency of degumming ability, can quickly reduce the viscosity of UV film affixed to the materials.
-
Good Uniformity of the Scanning UV LED Curing System MachineDSXUV LEDUV Curing Systems are built for wafers with frame up to 450mm. The UV LED generates a wavelength of 365nm with an optical power output of maximum 800mW.
-
Multiple Silicon Wafer UV LED Curing System Machine Separated UV Tape from Wafer SemiconductorLED UV curing systems for reducing the adhesive strength of UV sensitive dicing tapes, effective UV 365nm, holds wafers up to 310mm
-
12 inches LED UV Tape Curing System Machine Debonding Tape from Wafer Semiconductor Chips12 inches LED UV Curing Systems Equipment is able to debond the UV tape from wafer semiconductor. The whole equipment is guaranteed for one year, non-human damage.
-
Full Automatic Nitrogen UV Tape Curing Machine Separate UV Film from Wafer Semiconductor365nm UV LED Box Type Curing Machine can be applied to all kind of UV tape debonding (for example, 6/8/12 inches wafer). Special box design to avoid UV leakage.