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  • LED UV Curing Box
    Small Wafer Nitrogen UV Curing System Tape LED UV Curing Box

    Nitrogen UV Curing System Tape Led,Compact and Practical UV Curing system, 5 seconds for The Film to Detach from The Wafer, Adjustable Time, Adjustable illumination, Nitrogen Protection

  • UV Curing System
    Wafer UV Curing System LED Tape UV Curing Machine Semiconductor Ceramic Substrate Square

    Illumination can be adjusted, Time can be adjusted, Even Curing, 5 seconds Curing,Compatible with multiple sizes

  • Wafer Expander Machine
    6 inch 8 inch Semi-automatic LED Wafer Expander Machine

    Equipped with nitrogen support rod, clamshell labor-saving function; Adjust the height of the working plate to rise, you can adjust the spacing between the DIE; Using the motor lifting and cylinder lifting to complete the membrane expansion process, to ensure the consistency of the membrane expansion;

  • Semi-automatic Wafer Mounter Machine
    DSXUV 12inch Semi-automatic Wafer Mounter Film Sticking Machine

    This equipment (lamator) is mainly used for 12 inch Si wafer BG film coating. No burrs, no bubbles. The wafer type is dummy wafer. This semi-automatic film sticking machine is suitable for applying film to products such as wafers, semiconductors, ceramics, and glass. It is a device used for film coating processing, specifically designed to precisely adhere thin film materials to the surface of wafers. It combines the characteristics of manual operation and automatic control, providing higher film application accuracy and efficiency while maintaining operational convenience.

  • Manual wafer tearing machine
    Manual Wafer Film Separator Silicon Stripping Machine

    This film tearing machine is used to remove the protective tape on the surface of wafers after thinning or etching processes. The device can be used for film tearing on 4 ", 5", 6 ", 8", and 12 "wafers.

Wafer Thickness Division

2023-04-19 17:31:56

Are 0.25mm wafers thin or thick? How thin or how thick is suitable for a wafer? How is it divided?

A 0.25mm wafer can be considered a thin wafer, but it is not really a thin wafer. The thickness of wafers varies according to application requirements. Generally, wafers less than or equal to 100μm (0.1mm) can be considered thin, and wafers greater than 100μm can be considered thick. In engineering and scientific research fields, the classification criteria of thickness will be different due to the consideration of different application requirements.


wafer mounting system


Relative to the integrated circuit, a typical 4inch wafer is 0.52mm, 6inch wafer is about 0.67mm thick. The wafer needs to be thinned, otherwise it will take a lot of wear and tear on the blade, and it will cut two times. For DIP packaging, 4 "wafers should be thinned to 0.3mm and 6" wafers should be thinned to about 0.32mm, error 0.02mm. Measuring the thickness of the instrument piece with a micrometer will do. The film thickness is generally measured by thermal wave instrument.  By measuring the thickness of different distribution points, the film thickness can be obtained by averaging, which generally reflects the uniformity of the film at the same time, and the simulation contour line can be seen. Germanium, silicon, selenium, gallium arsenide, and many metal oxides and metal sulfides, which are between conductors and insulators, are called semiconductors. Semiconductors have some special properties. The thermosensitive element (thermistor) for automatic control can be made by using the relation between the resistivity and temperature of the semiconductor.  Using its photosensitive characteristics can be made into automatic control of photosensitive components, such as photoelectric cell, photocell and photoresistor. One of the most important properties of semiconductors is that their ability to conduct electricity is increased by millions of times if a small amount of impurities are properly added to a pure semiconductor material.


standard wafer processing system


For wafer lamination machine / wafer mounter, wafer thickness is not the same, the selection of wafer laminating machine specifications are not the same. The mounting plate of wafer frame film mounter has a ceramic material plate, Teflon or other material mounting plate. Users must choose carefully according to their materials before purchasing.


Semi-Automatic Die Matrix Expander

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