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DSXUV 12inch Semi-automatic Wafer Mounter Film Sticking Machine DSXUV 12inch Semi-automatic Wafer Mounter Film Sticking Machine

DSXUV 12inch Semi-automatic Wafer Mounter Film Sticking Machine

This equipment (lamator) is mainly used for 12 inch Si wafer BG film coating. No burrs, no bubbles. The wafer type is dummy wafer. This semi-automatic film sticking machine is suitable for applying film to products such as wafers, semiconductors, ceramics, and glass. It is a device used for film coating processing, specifically designed to precisely adhere thin film materials to the surface of wafers. It combines the characteristics of manual operation and automatic control, providing higher film application accuracy and efficiency while maintaining operational convenience.
  • model no. :

    DSXUV- Semi-auto-BGWM12
  • port of dispatch :

    Shenzhen
  • Payment :

    T/T 100% before shipment
  • original region :

    China
  • Lead Time :

    15-20days
Product Details
The semi-automatic wafer laminating machine is suitable for various wafer size ranges and can process wafers from small to large sizes. It adopts advanced film sticking technology to ensure a tight fit between the film and the wafer, protecting the wafer surface from contamination, oxidation, or other damage. The film sticking process can be automatically or semi-automatic according to the needs, providing flexible operating options.


Local features:
1. Suitable for BG film, UV film, and blue film;
2. Suitable for 12 inch wafer with iron ring for slicing
3. Easy to operate, adjustable blade cutting position;
4. The film has no cracks, no bubbles on the surface, no burrs on the edges, and no other abnormalities;
5. The main body is made of stainless steel and aluminum alloy, with reliable quality and stable performance;
6. The film has high precision and stability;
7. Simple operation, easy to understand and master;
8. The appearance of this machine is beautiful, sturdy and reliable, with superior performance and affordable price, which can greatly improve production efficiency for customers.

Tube size: diameter 8mm
Machine casing: white spray painted metal casing
Volume: length 1450 * width 650 * height 497mm
Net weight: approximately 150KG

Packing List:
1 machine
2. One power cord
3. One manual
4. One copy of warranty card and one copy of certificate of conformity
5. One circular cutting blade
6. One cross cutting knife
7. One catheter
Consumables for vulnerable parts
Round cutting blade
Cross cutting blade
Air duct
Solenoid valve


The Shenzhen Deshengxing Electronics semi-automatic wafer laminating machine has the following functions and advantages:
1. Film application accuracy: The semi-automatic wafer film application machine adopts advanced film application technology and precise alignment system, which can achieve high-precision film application operation, ensuring accurate alignment and bonding between the film material and the wafer.
2. Wafer size adaptability: The semi-automatic wafer laminating machine is suitable for various wafer size ranges and can handle wafers from small to large sizes, providing flexible usage options.
3. Operational convenience: The equipment is equipped with a user-friendly interface and control system, allowing operators to easily master and operate the equipment, reducing training costs and learning difficulties for operators.
In semi-automatic mode, operators can participate in some operations as needed, providing more flexible film selection.
5. High efficiency: The semi-automatic wafer laminating machine can quickly complete laminating tasks, improve production efficiency, shorten laminating cycles, and is suitable for situations that require efficient processing of small batches of wafers.
6. Safety: The equipment is equipped with safety features such as safety sensors and emergency stop buttons to ensure the safety of the operation process and reduce potential risks for operators.
7. Accessories and Accessories: The semi-automatic wafer laminating machine can be equipped with various accessories and accessories, such as laminating tools and laminating materials, to meet different laminating needs.
8. Reliability and stability: The equipment design has undergone strict engineering and quality control, with good reliability and stability, and can operate stably for a long time, reducing equipment failures and maintenance costs.


In summary, the semi-automatic wafer laminating machine has become an important equipment choice in wafer production and processing due to its high-precision laminating operation, wafer size adaptability, ease of operation, and safety. It can improve the quality and efficiency of film coating, providing reliable solutions for wafer manufacturing and the semiconductor industry.



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