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  • LED UV Curing Box
    Small Wafer Nitrogen UV Curing System Tape LED UV Curing Box

    Nitrogen UV Curing System Tape Led,Compact and Practical UV Curing system, 5 seconds for The Film to Detach from The Wafer, Adjustable Time, Adjustable illumination, Nitrogen Protection

  • UV Curing System
    Wafer UV Curing System LED Tape UV Curing Machine Semiconductor Ceramic Substrate Square

    Illumination can be adjusted, Time can be adjusted, Even Curing, 5 seconds Curing,Compatible with multiple sizes

  • Wafer Expander Machine
    6 inch 8 inch Semi-automatic LED Wafer Expander Machine

    Equipped with nitrogen support rod, clamshell labor-saving function; Adjust the height of the working plate to rise, you can adjust the spacing between the DIE; Using the motor lifting and cylinder lifting to complete the membrane expansion process, to ensure the consistency of the membrane expansion;

  • Semi-automatic Wafer Mounter Machine
    DSXUV 12inch Semi-automatic Wafer Mounter Film Sticking Machine

    This equipment (lamator) is mainly used for 12 inch Si wafer BG film coating. No burrs, no bubbles. The wafer type is dummy wafer. This semi-automatic film sticking machine is suitable for applying film to products such as wafers, semiconductors, ceramics, and glass. It is a device used for film coating processing, specifically designed to precisely adhere thin film materials to the surface of wafers. It combines the characteristics of manual operation and automatic control, providing higher film application accuracy and efficiency while maintaining operational convenience.

  • Manual wafer tearing machine
    Manual Wafer Film Separator Silicon Stripping Machine

    This film tearing machine is used to remove the protective tape on the surface of wafers after thinning or etching processes. The device can be used for film tearing on 4 ", 5", 6 ", 8", and 12 "wafers.

The Problem of UV Curing Machine Fan Cooling

2023-01-10 18:03:35

For UV LED Spot Light Source, Linear UV LED Curing Light, the heat dissipation mode is generally adopted fan cooling. When the fan is installed, there are two situations: one is to below air to the radiator, the other is to draw air in the opposite direction. The internal structure of conventional fan cooling irradiation head is shown below:


What are the characteristics of these methods? The answers are showed as below:

Fan Cooling UV LED Curing Machine

Characteristics of Below Air to the Radiator:

1.The air flow near the fan outlet is mainly turbulent and the local heat transfer is strong. It is suitable for the situation where the heating element is relatively concentrated. In this case, the main outlet of the fan must be aligned with the concentrated heating element.

2.When blowing, positive will be formed inside the device to prevent dust from entering the gaps in the device.

3.The fan will not be affected by the heat dissipation of the system.  The fan works at a lower air temperature and has a longer service life.

4.Because the air blower has certain directivity, the air supply volume on the cross section of the entire enclosure will be uneven.

5.There will be a reflux and low speed zone near the fan HUB and between the parallel exhaust fans, resulting in poor heat transfer effect.  It is advisable to keep the distance between the fan and the radiator at about 15mm.

Linear UV LED Curing Lamp

Characteristics of Draw Air in the Opposite Direction:

1.Uniform air supply, suitable for heating device distribution is more uniform, more complex air duct situation.

2.The flow into the fan is mainly laminar flow

3.The service life of the fan is affected when the fan works under high temperature air flow in the outlet.

4.Negative pressure is formed in the equipment, and dust can enter through the gaps in the equipment.

Fan Cooling UV LED Curing Light Source

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