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  • Where can I find a manual 12-inch wafer Expander manufacturer?
    Where can I find a manual 12-inch wafer Expander manufacturer?
    2024-01-12

    A 12-inch manual Wafer Expander machine is a device used for expanding or stretching various materials. It is operated manually and features a 12-inch width, which determines the maximum size of the material it can accommodate. The machine is designed to provide controlled and uniform stretching to achieve desired results. Manual 12-inch wafer Expander manufacturer manufacturer:leduvcuring.com&nbs...

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  • Comparison of UV Tape and Blue Film
    Comparison of UV Tape and Blue Film
    2023-11-03

    Both the UV tape and blue film are viscous, and their viscosity is expressed by the viscous peel degree, usually N/20 mm or N/25 mm. For example, the meaning of 1 N/20 mm is that the width of the test strip is 20 mm, and the force to peel it off from the test version with a 180° peel Angle is 1 N. UV film is a special formulation of coating on the surface of PET film substrate, to achieve the effe...

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  • Characteristics of UV Tape and Blue Film
    Characteristics of UV Tape and Blue Film
    2023-10-24

    Before the wafer is thinned, a sticky film is attached to the front of the wafer. The role of the film is to secure the chip on the front of the wafer, which is easy for the grinding machine to grind on the back of the wafer. Generally, the thickness of the silicon wafer before grinding is about 700 μm, and after grinding, the thickness of the wafer becomes 200 μm, or even 120 μm. The wafer thinni...

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  • 365nm UV LED  NVSU233C-D4 Application
    365nm UV LED NVSU233C-D4 Application
    2023-10-08

    parameter Model: NVSU233C-D4 Peak wavelength 365nm Forward current: 1400mA Power: 5.88W Voltage: 3.6-4V Radiation flux:>1450mW/cm2 Lens material: quartz glass Lens angle: 60 degrees Size: 3.5X3.5mm Application field: The most commonly used areas are UV curing and bonding. UV glue and UV ink curing. The applicable devices are UV LED point light sources, UV LED line light sources, and UV LED surf...

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  • Configuration of Offset Printing Press UV LED Curing Machine
    Configuration of Offset Printing Press UV LED Curing Machine
    2023-07-06

    Generally, 2 to 3 UV lamps are installed in the middle part of the paper receiving chain rail, and an exhaust pipe is installed at the top of the paper receiving part, and a UV curing device can also be separately connected, and the conveyor belt is connected to the paper receiving table part. Obviously, the latter, due to the limitation of the conveyor belt speed of the UV curing device, will aff...

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  • Wafer Thickness Division
    Wafer Thickness Division
    2023-04-19

    Are 0.25mm wafers thin or thick? How thin or how thick is suitable for a wafer? How is it divided? A 0.25mm wafer can be considered a thin wafer, but it is not really a thin wafer. The thickness of wafers varies according to application requirements. Generally, wafers less than or equal to 100μm (0.1mm) can be considered thin, and wafers greater than 100μm can be considered thick. In engineering a...

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  • The Problem of UV Curing Machine Fan Cooling
    The Problem of UV Curing Machine Fan Cooling
    2023-01-10

    For UV LED Spot Light Source, Linear UV LED Curing Light, the heat dissipation mode is generally adopted fan cooling. When the fan is installed, there are two situations: one is to below air to the radiator, the other is to draw air in the opposite direction. The internal structure of conventional fan cooling irradiation head is shown below: What are the characteristics of these methods? The answe...

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  • Introduction of Wafer Bonding Technology
    Introduction of Wafer Bonding Technology
    2022-12-29

    Bonding means attaching two objects together with a seal (often permanently) Microtechnology involves various types of bonding processes Used in IC packaging and printed circuit board assembly. Will not be covered in this lecture. - Wafer bonding - Wire bonding - Flip chip bonding Wafer bonding 1: as a way to make advanced starting wafers SOI) 2: as a way to create complex 3D structures and caviti...

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a total of 11 pages

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