Bonding means attaching two objects together with a seal (often permanently) Microtechnology involves various types of bonding processes Used in IC packaging and printed circuit board assembly. Will not be covered in this lecture. - Wafer bonding - Wire bonding - Flip chip bonding Wafer bonding 1: as a way to make advanced starting wafers SOI) 2: as a way to create complex 3D structures and caviti...
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