In the backside thinning process of a wafer, the thin film attached to the front side of the wafer (including the active device and microstructure side) is called a backside thinning tape (BG Tape or thin film in the industry) Its core function is to protect the integrated circuits and micro bumps on the front side of the wafer from physical scratches, contamination by grinding fluid and silicon p...

NICHIA MWSU333B 385nm is a top-tier single-chip UV LED with 20W high power, rated at 3.7V and 6000mA. It serves as the core light source module for PCB Laser Direct Imaging (LDI) exposure machines. Laser Direct Imaging (LDI) is critical equipment in PCB manufacturing, utilized for exposing dry film, wet film and solder mask ink. "6LED" means the light source module consists of six independently co...

Custom 4-Inch Wafer Gold Layer Peeling Machine Gold Layer Peeling Machine is designed for precise and efficient wafer film and gold layer peeling, featuring stable operation and high processing accuracy for semiconductor applications. This is a new product recently developed by our company, and both manual and semi-automatic can be customized.

The semi-automatic wafer expander machine has significant advantages in multiple fields, and the following are some of the main benefits summarized based on search results: 1. Improve production efficiency: The semi-automatic wafer expander machine can automatically cut the film, adjust the speed and stroke, and achieve uniform and smooth electric film expansion. It adopts dual cylinder up and dow...

How to Choose a Wafer Laminator Machine for Semiconductor Packaging In semiconductor packaging, wafer laminator machines (also called wafer mounters or wafer taping systems) are the unsung heroes of yield and reliability. They apply protective dicing tapes, UV films, or DAF (Die Attach Film) to wafers before thinning, dicing, and assembly—directly impacting wafer stability, chip integrity, and fin...

UV furniture paint is widely used in industrial production because of its excellent performance and environmental protection and easy painting characteristics. But the perfect curing of UV furniture paint can not be achieved by any UV curing equipment. For the curing of UV varnish on furniture, Guangdong SpaceLight Technology Co., Ltd. has successfully developed and produced a Hand-held UV Curing ...

Wafer processing: The main task of this process is to fabricate circuits and electronic components (such as transistors, capacitors, logic switches, etc.) on the wafer. The processing procedure is usually related to the type of product and the technology used, but the basic steps are to first clean the wafer appropriately, then oxidize and chemically vapor deposit it on the surface, and then perfo...

Attach the wafer to the blue film: Use a dedicated Areas where wafer laminating machine sticking to gently suction the thinned wafer and then accurately press it onto the center of the blue film to ensure that the wafer adheres smoothly to the film as a whole. During the operation, it is necessary to avoid generating bubbles or particles to prevent affecting the quality of subsequent cutting....