Ceramic substrate laminating machine, can be customized according to customer requirements, vacuum suction cup, temperature adjustable

6-inch 8-inch compatible wafer laminating machine, sharing one tray with 6-inch 8-inch iron ring, but only suitable for sticking empty film. Cannot bring product stickers.

Features of Semi-automatic Film Sticking Machine: 1) Fast efficiency, fast film application speed, and increased daily production capacity 2) Stable quality, no bubbles, no wrinkles, no curled edges, high yield rate 3) The height of the chuck can be adjusted to meet the requirements of products with a thickness of 150-750um Our factory has its own R&D team and accepts customization Give equal ...

In the backside thinning process of a wafer, the thin film attached to the front side of the wafer (including the active device and microstructure side) is called a backside thinning tape (BG Tape or thin film in the industry) Its core function is to protect the integrated circuits and micro bumps on the front side of the wafer from physical scratches, contamination by grinding fluid and silicon p...

NICHIA MWSU333B 385nm is a top-tier single-chip UV LED with 20W high power, rated at 3.7V and 6000mA. It serves as the core light source module for PCB Laser Direct Imaging (LDI) exposure machines. Laser Direct Imaging (LDI) is critical equipment in PCB manufacturing, utilized for exposing dry film, wet film and solder mask ink. "6LED" means the light source module consists of six independently co...

Custom 4-Inch Wafer Gold Layer Peeling Machine Gold Layer Peeling Machine is designed for precise and efficient wafer film and gold layer peeling, featuring stable operation and high processing accuracy for semiconductor applications. This is a new product recently developed by our company, and both manual and semi-automatic can be customized.

The semi-automatic wafer expander machine has significant advantages in multiple fields, and the following are some of the main benefits summarized based on search results: 1. Improve production efficiency: The semi-automatic wafer expander machine can automatically cut the film, adjust the speed and stroke, and achieve uniform and smooth electric film expansion. It adopts dual cylinder up and dow...

How to Choose a Wafer Laminator Machine for Semiconductor Packaging In semiconductor packaging, wafer laminator machines (also called wafer mounters or wafer taping systems) are the unsung heroes of yield and reliability. They apply protective dicing tapes, UV films, or DAF (Die Attach Film) to wafers before thinning, dicing, and assembly—directly impacting wafer stability, chip integrity, and fin...