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  • LED UV Curing Box
    Small Wafer Nitrogen UV Curing System Tape LED UV Curing Box

    Nitrogen UV Curing System Tape Led,Compact and Practical UV Curing system, 5 seconds for The Film to Detach from The Wafer, Adjustable Time, Adjustable illumination, Nitrogen Protection

  • UV Curing System
    Wafer UV Curing System LED Tape UV Curing Machine Semiconductor Ceramic Substrate Square

    Illumination can be adjusted, Time can be adjusted, Even Curing, 5 seconds Curing,Compatible with multiple sizes

  • Wafer Expander Machine
    6 inch 8 inch Semi-automatic LED Wafer Expander Machine

    Equipped with nitrogen support rod, clamshell labor-saving function; Adjust the height of the working plate to rise, you can adjust the spacing between the DIE; Using the motor lifting and cylinder lifting to complete the membrane expansion process, to ensure the consistency of the membrane expansion;

  • Semi-automatic Wafer Mounter Machine
    DSXUV 12inch Semi-automatic Wafer Mounter Film Sticking Machine

    This equipment (lamator) is mainly used for 12 inch Si wafer BG film coating. No burrs, no bubbles. The wafer type is dummy wafer. This semi-automatic film sticking machine is suitable for applying film to products such as wafers, semiconductors, ceramics, and glass. It is a device used for film coating processing, specifically designed to precisely adhere thin film materials to the surface of wafers. It combines the characteristics of manual operation and automatic control, providing higher film application accuracy and efficiency while maintaining operational convenience.

  • Manual wafer tearing machine
    Manual Wafer Film Separator Silicon Stripping Machine

    This film tearing machine is used to remove the protective tape on the surface of wafers after thinning or etching processes. The device can be used for film tearing on 4 ", 5", 6 ", 8", and 12 "wafers.

  • What are the specifications of wafer?
    What are the specifications of wafer?
    2024-05-28

    There are various specifications and types of wafers. Here are some common wafer specifications and types: 1. Diameter: The diameter of a wafer is one of the most commonly used specifications. Common diameters include: - 200mm: also known as 8-inch wafers. - 300mm: also known as 12-inch wafers. - 150mm, 100mm, 75mm, 50mm, etc. 2. Thickness: The thickness of wafers is usually controlled and adjuste...

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  • Offset Press Why to Modify UVLED Curing Equipment
    Offset Press Why to Modify UVLED Curing Equipment
    2024-05-22

    First, it takes 4 ~ 8min to start the high-pressure mercury lamp from the start to the stable operation of the lamp, and the photoelectric parameters change greatly during the start process. In addition, in a low temperature environment, the start of high-pressure mercury lamps will be more difficult, or even can not start. After the high-pressure mercury lamp is extinguished during work, it canno...

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  • Multi band ultraviolet irradiance meter
    Multi band ultraviolet irradiance meter
    2024-04-30

    The DSXUVUV strength Meter 5800 series is widely used in various industries in the UV field. It offers multiple options for selecting different UV wavelengths and can measure real-time power, peak power, average power, minimum power, and energy value of UV light sources. It allows users to test different regions of UV light sources and evaluate their uniformity. The instrument is designed for simp...

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  • Advantages of Installing UVLED Curing System in Offset Press
    Advantages of Installing UVLED Curing System in Offset Press
    2024-04-16

    Offset printing is one of the main printing methods, with the development of UVLED light curing technology, UVLED curing system gradually replaced the traditional UV curing, at present, there are also printing plants for offset printing press installed UVLED curing system. Why can UVLED curing system replace mercury lamp? The service life of mercury lamp is short, generally about 1000 hours. Mercu...

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  • What's the Principle of UV glue remover
    What's the Principle of UV glue remover
    2024-04-15

    UV debonding, also known asaviolet (UV) debonding, is a technology based on UV irradiation and chemical reactions used for curing or debonding adhesives, coatings, inks, and other materials. The principle involves the use of a photoinitiator and UV irradiation. 1. Photoinitiator: A photoinitiator is a chemical substance that absorbs UV light and undergoes a chemical reaction, generating free radic...

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  • Where can I find a manual 12-inch wafer Expander manufacturer?
    Where can I find a manual 12-inch wafer Expander manufacturer?
    2024-04-15

    A 12-inch manual Wafer Expander machine is a device used for expanding or stretching various materials. It is operated manually and features a 12-inch width, which determines the maximum size of the material it can accommodate. The machine is designed to provide controlled and uniform stretching to achieve desired results. Manual 12-inch wafer Expander manufacturer manufacturer:leduvcuring.com The...

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  • Comparison of UV Tape and Blue Film
    Comparison of UV Tape and Blue Film
    2023-11-03

    Both the UV tape and blue film are viscous, and their viscosity is expressed by the viscous peel degree, usually N/20 mm or N/25 mm. For example, the meaning of 1 N/20 mm is that the width of the test strip is 20 mm, and the force to peel it off from the test version with a 180° peel Angle is 1 N. UV film is a special formulation of coating on the surface of PET film substrate, to achieve the effe...

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  • Characteristics of UV Tape and Blue Film
    Characteristics of UV Tape and Blue Film
    2023-10-24

    Before the wafer is thinned, a sticky film is attached to the front of the wafer. The role of the film is to secure the chip on the front of the wafer, which is easy for the grinding machine to grind on the back of the wafer. Generally, the thickness of the silicon wafer before grinding is about 700 μm, and after grinding, the thickness of the wafer becomes 200 μm, or even 120 μm. The wafer thinni...

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a total of 13 pages

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