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  • LED UV Curing Box
    Small Wafer Nitrogen UV Curing System Tape LED UV Curing Box

    Nitrogen UV Curing System Tape Led,Compact and Practical UV Curing system, 5 seconds for The Film to Detach from The Wafer, Adjustable Time, Adjustable illumination, Nitrogen Protection

  • UV Curing System
    Wafer UV Curing System LED Tape UV Curing Machine Semiconductor Ceramic Substrate Square

    Illumination can be adjusted, Time can be adjusted, Even Curing, 5 seconds Curing,Compatible with multiple sizes

  • Wafer Expander Machine
    6 inch 8 inch Semi-automatic LED Wafer Expander Machine

    Equipped with nitrogen support rod, clamshell labor-saving function; Adjust the height of the working plate to rise, you can adjust the spacing between the DIE; Using the motor lifting and cylinder lifting to complete the membrane expansion process, to ensure the consistency of the membrane expansion;

  • Semi-automatic Wafer Mounter Machine
    DSXUV 12inch Semi-automatic Wafer Mounter Film Sticking Machine

    This equipment (lamator) is mainly used for 12 inch Si wafer BG film coating. No burrs, no bubbles. The wafer type is dummy wafer. This semi-automatic film sticking machine is suitable for applying film to products such as wafers, semiconductors, ceramics, and glass. It is a device used for film coating processing, specifically designed to precisely adhere thin film materials to the surface of wafers. It combines the characteristics of manual operation and automatic control, providing higher film application accuracy and efficiency while maintaining operational convenience.

  • Manual wafer tearing machine
    Manual Wafer Film Separator Silicon Stripping Machine

    This film tearing machine is used to remove the protective tape on the surface of wafers after thinning or etching processes. The device can be used for film tearing on 4 ", 5", 6 ", 8", and 12 "wafers.

  • 365nm UV LED  NVSU233C-D4 Application
    365nm UV LED NVSU233C-D4 Application
    2023-10-08

    parameter Model: NVSU233C-D4 Peak wavelength 365nm Forward current: 1400mA Power: 5.88W Voltage: 3.6-4V Radiation flux:>1450mW/cm2 Lens material: quartz glass Lens angle: 60 degrees Size: 3.5X3.5mm Application field: The most commonly used areas are UV curing and bonding. UV glue and UV ink curing. The applicable devices are UV LED point light sources, UV LED line light sources, and UV LED surf...

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  • Configuration of Offset Printing Press UV LED Curing Machine
    Configuration of Offset Printing Press UV LED Curing Machine
    2023-07-06

    Generally, 2 to 3 UV lamps are installed in the middle part of the paper receiving chain rail, and an exhaust pipe is installed at the top of the paper receiving part, and a UV curing device can also be separately connected, and the conveyor belt is connected to the paper receiving table part. Obviously, the latter, due to the limitation of the conveyor belt speed of the UV curing device, will aff...

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  • Wafer Thickness Division
    Wafer Thickness Division
    2023-04-19

    Are 0.25mm wafers thin or thick? How thin or how thick is suitable for a wafer? How is it divided? A 0.25mm wafer can be considered a thin wafer, but it is not really a thin wafer. The thickness of wafers varies according to application requirements. Generally, wafers less than or equal to 100μm (0.1mm) can be considered thin, and wafers greater than 100μm can be considered thick. In engineering a...

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  • The Problem of UV Curing Machine Fan Cooling
    The Problem of UV Curing Machine Fan Cooling
    2023-01-10

    For UV LED Spot Light Source, Linear UV LED Curing Light, the heat dissipation mode is generally adopted fan cooling. When the fan is installed, there are two situations: one is to below air to the radiator, the other is to draw air in the opposite direction. The internal structure of conventional fan cooling irradiation head is shown below: What are the characteristics of these methods? The answe...

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  • Introduction of Wafer Bonding Technology
    Introduction of Wafer Bonding Technology
    2022-12-29

    Bonding means attaching two objects together with a seal (often permanently) Microtechnology involves various types of bonding processes Used in IC packaging and printed circuit board assembly. Will not be covered in this lecture. - Wafer bonding - Wire bonding - Flip chip bonding Wafer bonding 1: as a way to make advanced starting wafers SOI) 2: as a way to create complex 3D structures and caviti...

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  • Where can Calibrate EIT UV POWER PUCK II and EIT UVICURE PLUS II
    Where can Calibrate EIT UV POWER PUCK II and EIT UVICURE PLUS II
    2022-06-27

    1.EIT UV POWER PUCK II and EIT UVI CURE PLUS II UV energy meter calibration and commissioning unit: Shezhen Deshengxing Electronics Co., Ltd.. Address information for returning repairs and calibration: F3, Building 5, Zhangmutou, Dongguan, Guangdong, China, 523637. Contact: +86-18924372460 Jennifer. Our customer service staff will contact you as soon as possible. 2.About the users who issue the re...

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  • How does Wafer Film Expander Work
    How does Wafer Film Expander Work
    2022-05-31

    Wafer film expander is a film expander clamping device, including upper base, lower base, upper pressing plate and lower pressing plate. A guide rod and a driving rod are arranged between the upper and lower bases. Both ends of the guide rod are vertically connected with the upper and lower bases respectively. The rotation of the lower end of the drive rod is limited in the lower base, and the upp...

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  • Advantages of Offset Printing Machine Modified UVLED Curing System
    Advantages of Offset Printing Machine Modified UVLED Curing System
    2022-03-25

    UVLED curing systems have gradually replaced UV mercury lamps in the printing industry. So, offset printing machine modified UV LED curing systems has the advantages of those? It will state as follows: 1.Low temperature consumption The power consumption of the UVLED curing system is 30% of that of the UV mercury lamp. 2.Instantly ON-OFF It can reach the maximum output without preheating, and can b...

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a total of 12 pages

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