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Customized 6 8 12 inch Crystal Iron Ring Wafer Cutting Film Hoop for Wafer FoundryThe selection material of Stainless Steel Wafer Iron Rings is through SGS certification, high bending strength, high hardness, can bear high load, high wear, corrosive media.
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12 inches Wafer Frame Dicing Cutting Ring Round Fixed Silicon Disk Iron Ring For Wafer Blue FilmStainless Steel 12'' Iron Ring Wafer Frame is strong hardness, resistance to bending, good stickiness, durability.
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6 Inches Dicing Wafer Frame Iron Hoop Semiconductor Fixed Cutting Ring SUS420J Material6 inches Wafer Expander Rings is used for semiconductor packaging, film, cutting, adhesive process bearing appliances.
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Nitrogen UV Curing Systems Multiple 6 inches Wafer Dicing MachineCuring multiple 6 inches UV Wafer at the same time, UV Film Tape Curing Systems reduce the adhesive strength of all UV-sensitive dicing tapes under controlled environment.
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UV LED Light Curing Systems Solidify 8 inches UV Wafer SemiconductorCompact, desktop profile accommodates up to 8’’ grip ring or film frame-mounted wafer.
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UV LED Exposure Box 150x200mm UV Curing Machine for Wafer Semiconductor LED LightsProfessional manufacturing DSX-150-200 UV Degumming Machine for semiconductor, wafer, curing UV glue UV ink, etc.
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Customized UV LED Cold Light Source UV LED Exposure Unit 365nm 395nmProfessional Manufacturing UV Wafer Tape Curing Machine is low calorie, good bonding performance, fast speed, environmental protection equipment.
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High Power 6'' 8'' 12'' UV Wafer Tape Curing Systems Curing SemiconductorUV Wafer Tape Curing System solves the curing process of wafer, glass and ceramic cutting technology, which is not only limited to semiconductor packaging industry, but also applicable to UV film curing of optical lens, LED, IC, semiconductor, integrated circuit board, mobile hard disk and other semiconductor materials.
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DSX-KYUV30 Low Temperature UV Masking Instant Super Curing Glue Semiautomatic UV LED Exposure MachineThe masking function of Environmentally Safe UV LED Exposure System enables to reach resolutions less than 2µm. It’s a new approach of masking, LED generation, unrivalled collimation performance.