Semi Automatic wafer expander machine, with a table height of 16-60mm and a chuck temperature of 0-100 degrees. The temperature is evenly dissipated, frame ring is expanded to hoop rings, or the UV film is expanded to grip ring
model no. :
DSX-26-161Brand:
DSXUVColor :
Whiteport of dispatch :
ShenzhenPayment :
100% T/T before shipmentoriginal region :
ChinaLead Time :
15 days8 inch Semi automatic Wafer Expansion Machine
| Model | DSXUV-WE-8 | Manufacturer | Guangdong spacelight Electronics Co., Ltd |
| Size | 614*554*1100mm | Total Power | 500W |
| Technology |
Wafer, LED etc. after cutting film expansion process |
Product size | 2-8 inch , small than 210mm |
| Frame ring/ hoop ring |
frame ring:296-250mm Grip ring: 241-225mm |
Input power | 110-240V AC/ 50-60Hz |
| Film Type | UV Film, Blue film | Chuck temperature | 0-100°C |
| Expanding height | 16-60mm | Compressed air | 0.6-0.8 Pma |
| Cutting film | Machine cutting | Mode | Semi automatic |
If you need more detailed information, please send us an email promptly. Our company has a research and development team that accepts customized products.
Advantages & Features:
1,The stretching height and stretching speed can be digitally set via the touch screen
2, The chuck is equipped with constant temperature heating function to improve film ductility.
3, The spacing between dies can be adjusted by changing the lifting height of the working plate.
4,Optional top-mounted circular cutting function for automatic film cutting
5, 5-inch touch screen displays parameters, operation procedures and fault alarm prompts.
6, The fim stretching process is realized by motor lifting and cylinder lifing to ensure consistent stretching effect.
7. The equipment wll stop mmedliately f the grating sensoris blocked during automatic operation operation can
8.only resume after clearing the alarm.
Chip inversion machine can be used to transfer wafers from one film to another (such as UV film, blue film, optical film, etc.). This can be used to manufacture devices with specific functions, such as optical devices, sensors, and microelectronic components
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