Semi‑Automatic Wafer Mounter | 6/8/12 Inch Pre‑Thinning Lamination for Blue UV Film

Semi‑Auto Wafer Laminator, Semiconductor Wafer Film Sticking Machine

This Semi‑Automatic Wafer Mounter, 6‑/8‑/12‑Inch Pre‑Thinning LaminationMain Features of the MachineThe main body is constructed of stainless steel and aluminum alloy, delivering reliable quality and stable performance.High‑precision and consistent film lamination.Simple operation, easy‑to‑learn.Attractive appearance, sturdy and reliable with superior performance, greatly improving production efficiency.

Specifications

Additional Features of This Semi‑Automatic Mounter
This semi‑automatic mounter is compatible with 6‑inch, 8‑inch and 12‑inch round electronic‑grade glass substrates.
Lamination workflow: Manual loading & unloading → Machine film pulling → Manual cutting.
Self‑trimming of residual film at small flat‑edge/notch mark.
Glass thickness: 0.2 mm, 0.4 mm, 0.7 mm for 6‑inch & 8‑inch; 0.4 mm, 0.7 mm for 12‑inch.
(Remark: Machine marking is recommended in Traditional Chinese)
Works without iron frames; the machine supports both film lamination and film peeling.
Film specifications:
Previously 315 mm‑wide film used for 6‑/8‑inch workpieces. Recommended film width: 240 mm (±10 mm tolerance) for 6‑/8‑inch; 330 mm (±10 mm tolerance) for 12‑inch.
Core inner diameter: 76.2 mm; Film roll length: 200 meters.
Vacuum channels are also provided for the small flat‑edge direction; vacuum ports can be blocked as‑needed.

SIZE 

WHIGHT:200KG

WOODEN BOX 20KG