12 inches LED UV Curing Systems Equipment is able to debond the UV tape from wafer semiconductor. The whole equipment is guaranteed for one year, non-human damage.
model no. :
UV LED Curing SystemsBrand:
DSXUVport of dispatch :
ShenzhenPayment :
T/T 100% before shipmentoriginal region :
ChinaDSXUV-Tape-Curing UV Curing Systems are the most cost-effective UV tape exposure solutions on the market. Not merely their low cost, these units offer the same uniformity of UV exposure and fast UV curing times as other semiautomatic and automatic high-end UV curing systems. In addition, the Models DSXUV-Tape-Curing feature a new environmentally safe, ozone-free UV LED light beads array with a cool, low-temperature UV-A 365nm curing process.
Product Parameters :
Model |
DSXUV-Tape-Curing-12 |
Manufacturer |
Shenzhen Deshengxing Electronics,Co.,Ltd. |
Outside dimension |
L483.5*W469.54*H400.25mm |
Compatible with the size |
12 inches or less |
Cooling |
Air cooling |
Input power |
100-240V AC 50-60HZ |
Total power |
600pcs x3W=1800W |
Wavelength |
UV LED 365nm |
Capacity of drawer |
L392mm W384mmH7mm |
Intensity |
>600mW/cm2 |
Material / Weight |
White sheet metal /naked machine50kgpackaging55kg |
Display / Language |
Touch screen / English |
Function |
Adjustable time and illumination |
Irradiation direction |
Bottom-up |
Debonding tape area from a semiconductor wafer ring is 305mm
Suitable iron ring specification, 12 inches Wafer Ring Size, can be compatible with small size.
Features :
1.Small body, suitable for 6/8/10/12 inches wafer chips irradiation use
2.Time and brightness can be adjusted, touch screen operation, simple and convenient
3.Light from bottom to top for easy placement of wafers
4.LED cold light source, environmental protection product, with low temperature, uniform exposure, compact structure, small energy consumption, is the ideal model for semiconductor industry, and low temperature does not damage to thermal sensitive materials
5.The service life is more than 10 times longer than that of traditional mercury lamp, and the continuous service life is 15000-30000 hours
6.Zero maintenance cost, no need to replace the illuminant parts for long-term work.
7.Closed light source design, no damage to human body
8.Fast curing, tape can be bonded from wafer chips in few seconds
9.It can be compatible 12 inches or small sizes.
6 inches Wafer Expander Rings is used for semiconductor packaging, film, cutting, adhesive process bearing appliances.
Stainless Steel 12'' Iron Ring Wafer Frame is strong hardness, resistance to bending, good stickiness, durability.
The selection material of Stainless Steel Wafer Iron Rings is through SGS certification, high bending strength, high hardness, can bear high load, high wear, corrosive media.
Curing multiple 6 inches UV Wafer at the same time, UV Film Tape Curing Systems reduce the adhesive strength of all UV-sensitive dicing tapes under controlled environment.
Professional Manufacturing UV Wafer Tape Curing Machine is low calorie, good bonding performance, fast speed, environmental protection equipment.
Adhesive strength becomes lower when UV(Ultraviolet light) is irradiated by UV Tape UV Curing Systems.