Good Uniformity of the Scanning UV LED Curing System Machine

Opening the cover and inserting the wafer to the glass pane, then closing the lid, the UV LED Exposure Machine will start immediately. Curing is completed after about 10-60 seconds, yielding a consistent throughput of 50 to 180 wafers/hour. Fully adjustable exposure dose ranges between 80 mJ / cm2 to 1000 mJ / cm2.

There are numerous UV LED benefits such as less damage to the workpiece by exposure at ambient temperature, a very long lifetime, low power consumption, and safety for replacing the light source because it does not get hot compared to mercury lamps. Equipped with a high-output LED driver, we can achieve an exposure output over 600mW/cm2 (at 6.5mm work distance).

Feature of 6/8/12inch UV Light Curing Machine: 

Homogeneous Debonding

Specifications of Silicon Wafer LED UV Curing Equipment :

Frame size: 6/8/12 inches

Types of film: UV film

Wafer: 12 inches and under

Radiation light source: LED UV light source, cold light source, 365nm

Intensity: 600-1000mW/cm2

Place the fixture: 6/8/12 inches wafer can switch with each other

Handling mode: manual put in and take out

Product fixed: alignment pin location

Electric power supply: 220V, 350W,8A

Volume: 645mm*620mm*195mm (L*W*H)

Net weight: 40-50KG

Performance of Dicing UV Flim Degumming Machine:

PLC + touch screen, software control

Irradiation time: 1-999s setting

Production capacity per hour: about 200pcs for general products

Pre-charge nitrogen setting

Key Features of Automatic LED UV Curing Systems :

Low costing procurement = Lowest total cost of ownership (COO)!

No development of harmful ozone

Zero warm-up time

Long service life of UV-LEDs (10,000hrs+)

Low intensity drop (5% in 10,000hours)

No thermal influence on the film

Compact and robust table design

Short installation and implementation time

Low maintenance costs

Conforms to IEC204-1 safety standards

Productivity 50-180 wafer / hr.