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Ceramic Substrate Laminating Machine Square Frame Ring Semi-automatic Laminating Machine Ceramic Substrate Laminating Machine Square Frame Ring Semi-automatic Laminating Machine Ceramic Substrate Laminating Machine Square Frame Ring Semi-automatic Laminating Machine

Ceramic Substrate Laminating Machine Square Frame Ring Semi-automatic Laminating Machine

Support simultaneous film application on multiple chuck, Anti static heating table and vacuum adsorption product positioning function, Support square frame rings, Cutting film saving design,The chuck height can be adjusted

  • model no. :

    DSX26-113
  • Brand:

    DSXUV
  • Color :

    White
  • port of dispatch :

    Shenzhen
  • Payment :

    T/T before shipment
  • original region :

    China
  • Lead Time :

    16days
Product Details

Main Features of Wafer Mounter Machine:

The main body is made of stainless steel and aluminum alloy, with reliable quality and stable performance;

Support square iron ring film application;

Support simultaneous film application on multiple ceramic substrates;

Product positioning does not deviate;

Supports multiple thicknesses and adjustable heights;

High precision and stability of film application;

Easy to operate, easy to understand and master;

Beautiful appearance, sturdy and reliable, superior performance, and can greatly improve production efficiency.

Main Features of Square Laminating Machine:

The main body is made of stainless steel and aluminum alloy, with reliable quality and stable performance;

Support square iron ring film application;

Support simultaneous film application on multiple ceramic substrates;

Product positioning does not deviate;

Supports multiple thicknesses and adjustable heights;

High precision and stability of film application;

Easy to operate, easy to understand and master;

Beautiful appearance, sturdy and reliable, superior performance, and can greatly improve production efficiency.

Ceramic Substrate Semi-automatic Laminating Machine:

1. Rated voltage AC-220V, supports customization of other 110-250V specifications

2 frequencies 50/60HZ

3 power<800W

4. Air pressure 0.5-0.6Mpa

5 machines weigh approximately 200kg

6 types of film: blue film/UV film

7. Film thickness: 0.05-0.2mm

Heating temperature of 8 plates: 0-70 ℃

9 automatic film application function

10 film cutting function manual rotary type

11 fragment rate of one in ten thousand

12. WPH>60PCS

13. The film should be free of particles, fragments, and any defects

Size 1358X 690 x483mm LX W H

14. Weight 170kg, with wooden box

ceramic substrate
Semi automatic wafer laminating machine



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