Multiple Silicon Wafer UV LED Curing System Machine Separated UV Tape from Wafer Semiconductor

Built to cure wafers up to Φ310mm size, providing 365nm wavelength, ozone free UV irradiation source, timer and status indicator, DSXUV UV LED curing system can make the UV-sensitive tape curing and hardening to reduce its adhesive strength in seconds.

Compared to conventional mercury-arc lamps, it utilizes high-capability LEDs. It enables to process a variety of materials at maximum production speeds and homogeneous illumination, with low-input power requirements.

Open the cover and insert the wafer to the glass pane. Close the lid. The exposure will start immediately. Curing is complete after about 10-60 seconds, yielding a consistent throughput of 50 to 180 wafers/hour. The intensity can be adjustable.

Long term research and development, production of various specifications of UV LED Curing Systems, DSXUV support customized multiple wafer LED UV curing system machine.

Features of multiple channel UV curing systems:

1.Multiple sizes of wafer crystal rings can be placed at the same time, including 6/8/12 inches and other customized sizes

2.Multi-channel design, can simultaneously debonding, also can independently debonding

3.Curing illumination and energy percentage adjustment function, illumination can be adjusted

4.Time to adjust

5.Prompt function after curing

6.It still use ultraviolet radiation from the bottom up the irradiation way, UV radiation directly to the UV film, avoid radiation damage to the wafer crystal element.

7.The enclosed curing light source has no effect on the human body.

8.Ultraviolet for LED packaging form, is no preheating and save time

9.Imported UV LED light source, service life is over 20000 hours