6 inches Wafer Expander Rings is used for semiconductor packaging, film, cutting, adhesive process bearing appliances.
model no. :
6 inches Iron RingBrand:
DSXUVport of dispatch :
ShenzhenPayment :
T/T 100% Before Shipmentoriginal region :
China6 inches Iron Ring Wafer Frame is strong hardness, resistance to bending, good stickiness and durability, widely used in semiconductor packaging, film, cutting, adhesive process bearing appliances.
Parameters of 6 inches Wafer Iron Rings :
Brand : DSXUV
Name : wafer chip ring
No. : DSMTQA06-000-R0
Material : SUS420j2 (stainless steel)
Specification : 6 inches (OD 228mm, ID 194mm)
Application : it can be widely used in semiconductor wafer packaging, film coating, cutting, solid crystal and other processes in electronics factory.
Features of Wafer Metal Frame :
1. Anti-folding, anti-corrosion and anti-scratching
Flatness : ≤0.2mm hardness : 50-55HRC
2. Heat treatment process
Wafer ring has good resistance to rebound after heat treatment
3. Precision machining precision
Wafer Iron Ring using laser cutting machine, cutting error is small.
4. Compatible with various packaging devices
Compatible with frame processing device (Disco, TSK, ADT, etc.)
5. Quality assurance durable
Stainless Steel 12'' Iron Ring Wafer Frame is strong hardness, resistance to bending, good stickiness, durability.
The selection material of Stainless Steel Wafer Iron Rings is through SGS certification, high bending strength, high hardness, can bear high load, high wear, corrosive media.
Curing multiple 6 inches UV Wafer at the same time, UV Film Tape Curing Systems reduce the adhesive strength of all UV-sensitive dicing tapes under controlled environment.
Professional Manufacturing UV Wafer Tape Curing Machine is low calorie, good bonding performance, fast speed, environmental protection equipment.
Adhesive strength becomes lower when UV(Ultraviolet light) is irradiated by UV Tape UV Curing Systems.
Professional manufacturing DSX-150-200 UV Degumming Machine for semiconductor, wafer, curing UV glue UV ink, etc.