Before the wafer is thinned, a sticky film is attached to the front of the wafer. The role of the film is to secure the chip on the front of the wafer, which is easy for the grinding machine to grind on the back of the wafer. Generally, the thickness of the silicon wafer before grinding is about 700 μm, and after grinding, the thickness of the wafer becomes 200 μm, or even 120 μm. The wafer thinni...

parameter Model: NVSU233C-D4 Peak wavelength 365nm Forward current: 1400mA Power: 5.88W Voltage: 3.6-4V Radiation flux:>1450mW/cm2 Lens material: quartz glass Lens angle: 60 degrees Size: 3.5X3.5mm Application field: The most commonly used areas are UV curing and bonding. UV glue and UV ink curing. The applicable devices are UV LED point light sources, UV LED line light sources, and UV LED surf...

Generally, 2 to 3 UV lamps are installed in the middle part of the paper receiving chain rail, and an exhaust pipe is installed at the top of the paper receiving part, and a UV curing device can also be separately connected, and the conveyor belt is connected to the paper receiving table part. Obviously, the latter, due to the limitation of the conveyor belt speed of the UV curing device, will aff...

Are 0.25mm wafers thin or thick? How thin or how thick is suitable for a wafer? How is it divided? A 0.25mm wafer can be considered a thin wafer, but it is not really a thin wafer. The thickness of wafers varies according to application requirements. Generally, wafers less than or equal to 100μm (0.1mm) can be considered thin, and wafers greater than 100μm can be considered thick. In engineering a...

For UV LED Spot Light Source, Linear UV LED Curing Light, the heat dissipation mode is generally adopted fan cooling. When the fan is installed, there are two situations: one is to below air to the radiator, the other is to draw air in the opposite direction. The internal structure of conventional fan cooling irradiation head is shown below: What are the characteristics of these methods? The answe...

Bonding means attaching two objects together with a seal (often permanently) Microtechnology involves various types of bonding processes Used in IC packaging and printed circuit board assembly. Will not be covered in this lecture. - Wafer bonding - Wire bonding - Flip chip bonding Wafer bonding 1: as a way to make advanced starting wafers SOI) 2: as a way to create complex 3D structures and caviti...

1.EIT UV POWER PUCK II and EIT UVI CURE PLUS II UV energy meter calibration and commissioning unit: Shezhen Deshengxing Electronics Co., Ltd.. Address information for returning repairs and calibration: F3, Building 5, Zhangmutou, Dongguan, Guangdong, China, 523637. Contact: +86-18924372460 Jennifer. Our customer service staff will contact you as soon as possible. 2.About the users who issue the re...

Wafer film expander is a film expander clamping device, including upper base, lower base, upper pressing plate and lower pressing plate. A guide rod and a driving rod are arranged between the upper and lower bases. Both ends of the guide rod are vertically connected with the upper and lower bases respectively. The rotation of the lower end of the drive rod is limited in the lower base, and the upp...