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New Products

Small Wafer Nitrogen UV Curing System Tape LED UV Curing Box
Nitrogen UV Curing System Tape Led,Compact and Practical UV Curing system, 5 seconds for The Film to Detach from The Wafer, Adjustable Time, Adjustable illumination, Nitrogen Protection
Wafer UV Curing System LED Tape UV Curing Machine Semiconductor Ceramic Substrate Square
Illumination can be adjusted, Time can be adjusted, Even Curing, 5 seconds Curing,Compatible with multiple sizes
6 inch 8 inch Semi-automatic LED Wafer Expander Machine
Equipped with nitrogen support rod, clamshell labor-saving function; Adjust the height of the working plate to rise, you can adjust the spacing between the DIE; Using the motor lifting and cylinder lifting to complete the membrane expansion process, to ensure the consistency of the membrane expansion;
DSXUV 12inch Semi-automatic Wafer Mounter Film Sticking Machine
This equipment (lamator) is mainly used for 12 inch Si wafer BG film coating. No burrs, no bubbles. The wafer type is dummy wafer. This semi-automatic film sticking machine is suitable for applying film to products such as wafers, semiconductors, ceramics, and glass. It is a device used for film coating processing, specifically designed to precisely adhere thin film materials to the surface of wafers. It combines the characteristics of manual operation and automatic control, providing higher film application accuracy and efficiency while maintaining operational convenience.
Manual Wafer Film Separator Silicon Stripping Machine
This film tearing machine is used to remove the protective tape on the surface of wafers after thinning or etching processes. The device can be used for film tearing on 4 ", 5", 6 ", 8", and 12 "wafers.

The Necessity of Adding Nitrogen to UV Curing System

2025-10-14 11:18:27

The difference between UV LED Curing Systemwith and without nitrogen addition is significant, andwhethernitrogen is necessary depends entirely on your process requirements.

Below is a detailed explanation of the differences, advantages, disadvantages, and how to determine if nitrogen is needed.

Core Difference: With Nitrogen vs. Without Nitrogen

The fundamental difference lies in the oxygen concentration in the working environment:

Without nitrogen:The process is carried out in normal air, with an oxygen concentration of approximately 21%.

With nitrogen:High-purity nitrogen is filled into the process chamber to reduce the oxygen concentration to an extremely low level (usually below 100 ppm, or even as low as 10 ppm).

This difference in oxygen concentration directly leads to variations in several key aspects, as detailed below.

Detailed Comparison of Differences

Comparison Dimension	Without Nitrogen (In Air)	With Nitrogen (Low-Oxygen Environment)
1.Degumming Efficiency/Speed	Slow. Oxygen "quenches" free radicals generated by UV light, competing with colloid molecules in reactions and severely inhibiting the degumming process.	Significantly faster. The inhibitory effect of oxygen is eliminated, allowing UV energy to be fully used to break the chemical bonds of colloid molecules. Efficiency can be increased by several to dozens of times.
2.Degumming Effect/Completeness	May be incomplete. Colloid residues are likely to remain on the wafer surface or in deep holes, especially for structures with large areas or high aspect ratios.	More thorough and uniform. Effectively removes hard-to-clean residual colloid, ensuring a clean and consistent wafer surface and improving product yield.
3.Process Temperature	Relatively high. To achieve a certain degumming rate, the substrate working temperature usually needs to be increased (e.g., above 250°C).	Can be significantly reduced. Efficient degumming can be achieved even at lower temperatures (e.g., 100°C - 150°C), making it a low-temperature process.
4.Damage to Devices	Potential for significant damage. Higher process temperatures may cause thermal damage to temperature-sensitive devices, pre-formed shallow junctions, metallization layers, etc.	Minimal damage. The low-temperature process makes it ideal for advanced manufacturing processes and temperature-sensitive devices (e.g., FinFETs, 3D NAND).
5. Surface Condition	May cause slight oxidation of metal layers or changes in surface states due to high temperatures and the presence of oxygen.	Creates an inert environment that better maintains the original state of the wafer surface and prevents oxidation.
6. Operating Cost	Low. No nitrogen consumption.	High. Requires continuous consumption of high-purity nitrogen, increasing operating costs.

Is It Necessary to Add Nitrogen? How to Judge?

Whether nitrogen functionality is needed depends on your application field, process node, and product yield requirements.
Below are the situations where adding nitrogen is recommended or optional.

When Adding Nitrogen Is Recommended

1. Advanced Semiconductor Manufacturing

Applicable for process nodes 90nm and below.
Used in temperature-sensitive devices such as FinFET, 3D NAND, and DRAM.
Necessary for photoresist removal in high-aspect-ratio structures.
Ensures high yield and stable process performance.

2. Temperature-Sensitive Devices and Materials

Includes compound semiconductors (GaAs, GaN), flexible electronics, and MEMS.
Also suitable for wafers that have completed metal wiring or doping and cannot withstand high temperatures.

3. Scientific Research and Development

Provides a controlled environment for exploring process parameters and obtaining optimal interface characteristics.

When Nitrogen May Not Be Necessary

1. Mature Process Nodes

For micron-level or 0.35μm and above processes, where temperature and residue requirements are less strict.

2. Cost-Sensitive Applications

For consumer-grade chips or devices where the cost increase from nitrogen does not justify the yield improvement.

3. Non-Critical Photoresist Removal

If UV degumming in air can already meet the process requirements.

Summary and Recommendation

Adding nitrogen helps eliminate oxygen inhibition and supports low-temperature, clean, and low-damage degumming. It is essential for advanced semiconductor manufacturing and applications that demand high precision and yield.

For traditional or cost-sensitive processes, skipping nitrogen can be a practical choice, but it may reduce efficiency, cleanliness, and process stability.