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5 inches Cold Light Source LED UV Exposure Equipment Curing Semiconductor Chips 5 inches Cold Light Source LED UV Exposure Equipment Curing Semiconductor Chips 5 inches Cold Light Source LED UV Exposure Equipment Curing Semiconductor Chips 5 inches Cold Light Source LED UV Exposure Equipment Curing Semiconductor Chips 5 inches Cold Light Source LED UV Exposure Equipment Curing Semiconductor Chips

5 inches Cold Light Source LED UV Exposure Equipment Curing Semiconductor Chips

The new generation of Deshengxing UV Light Curing Box Curing UV Film is with high speed of solidification for mass productiopn.

  • model no. :

    5 inches Ultraviolet Curing Machine
  • Brand:

    UV-LED CURING
  • Payment :

    T/T 100% Before Shipment
  • original region :

    China
Product Details

In the production process, in the use of the traditional ordinary curing machine, UV adhesive hardening processing speed is generally 30~40 seconds, curing time is long.

With the new generation of Deshengxing Cold Light Source LED UV Exposure Equipment, the curing time can be shortened to 3-5 seconds due to the accelerated reaction of UV wavelength and adhesive characteristics of the film. Therefore, this system is suitable for high speed of curing and can be used for R&D and mass production.


Application for Mini Ultraviolet Irradiation Machine Curing UV Film :

suitable for optical lens, LED, IC, semiconductor, wafer, integrated circuit board, mobile hard disk and other semiconductor materials UV film curing.


High Inyensity UV LED Exposure Equipment Curing Wafer Suppliers


Host Parameters of UV LLED Exposure System Curing Semiconductor :

Size

L320*W384*H246.8mm

Weight

6.5kg

Cooling

Air cooling

Input Power

100-240V AC 50-60 HZ

Material

White sheet metal

Drive the Number of Luminous Heads

A light source

Craft

Stoving varnish

Display and Operation

Touch screen display, adjustable time, illumination

Set the Lock

Changeable password

LED Time Accumulation Function

Actively record cumulative usage time


Size of Fixture Loading Slide Table :

Luminous Dimension of Light Source

5 inches

Total Power

432W

Inside dimension

L127*W101.6mm H15mm

Recommend highly

10~15mm

Cooling

Air cooling

Wavelength

365nm

Illuminance

300-2000mW/cm2

Light Source Predicts Service Life

20000 H



High Power UV Cure Adhesive Machine Curing Epoxy Resins Manufacturer


Characteristics of UV Irradiation Chamber Curing Wafer :

1.Size of Wafer : 4 inches, 5 inches, 6 inches, 8 inches, 12 inches, can be customized other size.

2.The operator simple places / picks up the crop, everything else is fully automated.

3.Model is small, drawer type sliding door simple operation

4.Match the fixture that user needs

5.Imported LED UV light source, low temperature environmental protection, no noise and radiation, exposure uniformity, compact structure, low energy consumption, is the ideal model for the semiconductor industry

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