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Semi Automatic Wafer Tape Expander for 10inch Frame Semi Automatic Wafer Tape Expander for 10inch Frame

Semi Automatic Wafer Tape Expander for 10inch Frame

This semi-automatic wafer expanding machine (MODEL :DSX26-052) is designed to expand die grains mounted on a 10-inch Frame ring and transfer them onto an 8-inch Frame ring.
  • model no. :

    DSX26-052
  • Brand:

    DSXUV
  • port of dispatch :

    SHENZHEN
  • Payment :

    TT100%
  • original region :

    CHINA
  • Lead Time :

    15DAYS
Product Details

Semi Automatic Wafer Tape Expander for 10inch Frame

This semi-automatic wafer expanding machine (MODEL :DSX26-052) is designed to expand die grains mounted on a 10-inch Frame ring and transfer them onto an 8-inch Frame ring.


Equipment Technical Parameters:

Name

Semi-automati Wafer Expansion Machine

Model

DSXUV-WE8

Size

L572*W563*1044mm

Wafer Size

6

Frame Size

10to 8

POWER

400W

Rated voltage

AC 220V

frequency

50/60HZ

Worktable elevation height

1-25mm

PRESSURE

0.5-0.8Mpa

Film Type

Blue film/White film/UV TAPE

TAPE  thickness

0.05-0.2mm

Film cutting method

Circular cutter automatically cuts the film

WARRANTY

No human damage incurred; full warranty valid for one year.

Weight

About 85kg

PLC

The touch screen combines buttons to enable manual/semi-automatic operation

Diffusion enhancement function

Manual loading/unloading, automatic lifting, film expansion, and automatic cutting of waste film outside the small rings

Heating temperature of the worktable

0-120℃

 

Process requirements for the Expander machine equipment



NO.

CONTENT

PARAMETER

1

Expanded tape size

The maximum expandable membrane size is 6 inches.

2

Diffusion membrane quality

No residual film, no broken membrane; smear expansion accuracy: ±0.1 mm

3

X and Y direction deviations of the diffuser spreading machine

+-0.05mmmm(Deviation in wafer placement during film removal)

4

Frame can be fixed

Equipped with an iron ring for positioning pins; no deliberate disassembly is required.

5

The work table can be heated

The peripheral expansion of the tape is uniform and moderate.

6

Function

The heating temperature, expansion time, and return speed are all adjustable.

7

Characteristic

The worktable does not compress the wafer during its lifting process.

Advantages & Features


1,The stretching height and stretching speed can be digitally set via the touch screen.
2,The chuck is equipped with constant temperature heating function to improve film ductility.
3,The spacing between dies can be adjusted by changing the lifting height of the working plate.
4,Optional top-mounted circular cutting function for automatic film cutting.
5,5-inch touch screen displays parameters, operation procedures and fault alarm prompts.
6,The film stretching process is realized by motor lifting and cylinder lifting to ensure consistent stretching effect.
7,The equipment will stop immediately if the grating sensor is blocked during automatic operation; operation can 8,only resume after clearing the alarm.

GET STARTED

You can contact us any way that is convenient for you. We are available 24/7 via, email or telephone.

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