10 Inch N2 Nitrogen UV Debonding Machine, Semiconductor Wafer UV Tape Degumming Equipment With Touch Screen & Alarm Function

No.

Item

Specification

Response

Configuration

1.1

Wafer size

6,8inch compatible

comply

1.2

Wafer tiickness

frame wafer 50um-500um

comply

1.3

Frame Size

8inch，compatible 6inch

comply

1.4

Device type

SEMI AOTO

comply

1.5

Curing material

UV tape

comply

1.6

Lamp type

UV LED

comply

1.7

Device protection

Power Off Procedure Saved

comply

1.8

Operation protection

Fully enclosed design for radiation isolation

comply

1.9

Gas supply

N2 gas for auxiliary gel dissolution; φ8 air tube

comply

1.10

ESDsystem

Ionized wind rod or ionized fan

Not comply

1.11

Device monitoring

The device program continuously records the irradiation time.

comply

1.12

LED LIFE

＞20000h

comply

1.13

Uv intensity

30-350mw/cm²

comply

1.14

Light Uniformity

＜10%

comply

1.15

energy uniformity

≥97%

comply

1.16

Light intensity attenuation rate

≤10%（≤10000H）

comply

1.17

Energy Accuracy

The deviation between actual irradiation energy and the set value is ≤ ±3%.

comply

1.18

range of exposures,range of irradiation

360mmX360mm

comply

1.19

irradiation time

Touchscreen settings are modificable

comply

1.20

UV film thickness

50um-300um UV tape

comply

1.21

Resolving Gel Appearance

解胶后无残胶

comply

1.22

WPH

＞60pcs/H

comply

1.23

UVIrradiation Function

Supports adjustable exposure times for different UV films

comply

SiC wafer Size

6〞(φ150.0mm)

 Diameter

150.0mm ±0.25

 Primary flat length

47.5 mm±2.5 mm

Secondary flat length

Not applicable

 Primary flat orientation

<11-20> ±5°

 Secondary flat orientation

Not applicable

 Thickness range

50~500μm

Wafer Transmittance

＞90%

 TTV Total Thickness

Variation

≤60um

（site 10mm×10mm）LTV

≤6 um

 Bow

≤85um

Warp

≤300um