model no. :
DSXUV26-051 SEMI AUTO WAFER MOUNTERBrand:
DSXUVport of dispatch :
SHENZHENPayment :
tt100%original region :
CHINALead Time :
15DAYSDSXUV Semi-Automatic Mounter automates the lamination, trimming, and cutting of the tape. include heated vacuum chambers to ensure the tape is applied evenly and securely to uneven or bumped wafer surfaces.
Semi Automatic Wafer Mounter DSXUV26-051 this model machine is for 10" Frame with 6"wafer,offcourse it is the same use for 8"wafer. Conduct us know more.
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1、Machine Parameter Description |
|||
|
Model: |
DSXUV-26-051 |
Fixed Form: |
vac-sorb |
|
location mode : |
Scale Positioning |
Heating System: |
Heating Pad（0-120℃） |
|
Pressure: |
0.5-0.8Mpa |
Power: |
800W |
|
Machine Voltage: |
AC220V-250v CAN CHOOSE 11 0v AND OTHER |
Operate mode: |
semi-automatic |
Configuration & requirement
|
No. |
Item |
Specification |
Response |
| DETAIL | |||
|
1.1 |
Technology |
MOUNT |
Comply |
|
1.2 |
Machine type |
6&8inch Sic thin wafer mount |
Comply 8寸frame 250mm |
|
1.3 |
Film Application Function |
Supports single-layer films, double-layer films, and UV films. |
Comply |
|
1.4 |
Film Mode |
Automatic film wrapping, automatic film rolling |
Comply |
|
1.5 |
ESD system |
Ionized wind rod or ionized fan |
Comply |
|
1.6 |
product size |
Wafer size：6inch compatible 8 inch SIC wafer ：Ø150±0.5mm or 200±0.5mm, Flat length: 47.5+/-2.5mm thickness, ply ：≥120um Total thickness deviation TTV: ≤15um The warping condition is satisfied≤0-3mm |
Comply |
|
1.7 |
Frame Wafercuting system |
Using the ring-cutting process, the Wafer is separated from the Frame. The reserved thickness for the post-cut film (the difference between the film diameter and the Wafer diameter) can be set to a value greater than 0.1 mm. |
Comply |
|
1.8 |
Film application accuracy |
The dimensional tolerance of the product's peripheral edges relative to Ring Huan is <0.5 mm (ABCD tolerance), and its θ-angle positioning accuracy is <0.5. |
Comply Regarding the placement of wafers by personnel |
|
1.9 |
stability, stabilization, steadiness, constancy |
Continuous operation for 500 pieces with no quality abnormalities observed. |
Comply |
|
1.10 |
UPH |
≥60pcs/H |
Comply |
|
1.11 |
Air gap |
Full Fit |
Comply |
|
1.12 |
Film Application Effect |
No wrinkles, no bubbles, and no fringes. |
Comply |
|
1.13 |
Supports double-sided film application |
No scratches on the product surface |
Comply |
|
1.14 |
Heat the plate dish |
Heating function: Room temperature to 80°C ±3°C |
Comply |
|
1.15 |
Plate Material |
Microholes, under vacuum conditions of ≥80 Pa |
Comply |
|
1.16 |
Worktop Material |
Containing Teflon or a protective coating |
Comply |
|
1.17 |
Tympanotomy blade |
Lifetime ≥200 pcs |
Comply |
2.1All process Specifications should be based on 6 inch Si &SiC wafer
Tool must be able to handle substrate with the following specifications，good Si & SIC 6inch wafer handling and process performance.
6inch silicon carbide wafer substrate specifications 6 inch.
|
SiC wafer Size |
6〞(φ150.0mm) |
|
Diameter |
150.0mm ±0.25 |
|
Primary flat length |
47.5 mm±2.5 mm |
|
Secondary flat length |
Not applicable |
|
Primary flat orientation |
<11-20> ±5° |
|
Secondary flat orientation |
Not applicable |
|
Thickness range |
50~500μm |
|
Wafer Transmittance |
＞90% |
|
Total thickness deviationTTV Total Thickness Variation |
≤60um |
|
（site 10mm×10mm）LTV |
≤6 um |
|
Bow |
≤85um |
|
Warp |
≤300um |
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Guangdong Spacelight Technology Co., Ltd.
Tel :
0086-18924372460Fax :
0086-0755-27289230Email :
uvcure@uvspacelight.comSkype :
live:1651063690jenniferWhatsapp :
+8618924372460
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+8618924372460
live:1651063690jennifer
uvcure@uvspacelight.com
0086-18924372460