8 Inch Manual Wafer Expander DSX-20-100

Manual Wafer Expander for Semiconductor

This 8 Inch Manual Wafer Expander DSX-20-100 is designed for semiconductor dicing thinning film, compatible with 10-inch 229-248-8mm mother-daughter ring. Equipped with constant temperature heating system, dual cylinder control, safety light grating, adjustable stretching stroke and temperature. Stable stretching speed 0.1~10mm/s, UPH 60, high yield 99.9%, widely used in chip packaging process. ESD protection, safety emergency stop, easy manual operation & maintenance.

1. Applicable Products

Product Info 
Product Name 
8-inch Manual Wafer Expander

 Model:DSX-20-100

Compatible with 10-inch mother-daughter expansion ring (229×248×8mm)
Tape Type: Dicing & Back Grinding Tape, 

Tape Thickness: 0.08–0.18 mm

2. Machine Introduction & Features

Machine Advantages
Adopts dual-cylinder vertical control system
Constant temperature design for uniform and moderate film stretching around the perimeter
Heating, stretching, die expanding and tape fixing finished in one single cycle
Heating temperature, expansion duration and stroke are fully adjustable
Simple operation, high single-shift output
Machine appearance refers to physical drawings
Technical Specifications
Power Supply: 220VAC (50Hz) ±10%
Operating Air Pressure: 4 Kg/cm²
Temperature Range: Ambient temperature ~ 100℃
Upper Cylinder Stroke: Lifting cylinder stroke 1–50mm, max adjustable to 50mm
Lower Cylinder Stroke: Fixed, non-adjustable
Expansion Area: 120/270 cm²
Overall Dimension: 491(L) × 482(W) × 922(H) mm
Machine Weight: 55 Kg (subject to actual weight)
Rated Power: 500 W
Outer Carton Dimension: 531(L) × 502(W) × 1002(H) mm

3,How to operate?

a,Plug in the power cord, and connect the high-pressure air tube to the quick connector of the air pipe.

b,Turn on the temperature control switch, set the temperature to 50–60°C (±5°C tolerance for different wafer tapes).
c,Press and hold the reset switch; the lower pressing plate moves to the top position, and the lifting plate retracts to the bottom position.
d,Place the inner ring on the lifting platform with the "△" mark facing downward.
e,Load the frame ring pre-attached with tape and wafers, lock it via positioning pins for alignment, and ensure the wafers face upward.
f,Press and hold the ring pressing switch.
g,Press and hold the lifting plate up switch to raise the platform. The stroke can be adjusted as required: Stroke adjustment is realized via the knob of the stroke cylinder at the machine bottom. Turn the knob upward to shorten the stroke, and turn it downward to extend the stroke.
h,Install the outer ring directly on top of the inner ring, align the positions accurately, and keep the "△" mark facing downward as well.
i,Press and hold the lower pressing plate down switch to clamp the mother-daughter ring tightly.
j,Press and hold the reset switch, then take out the finished product.
So easy to operate.