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Manual Wafer Film Separator Silicon Stripping MachineThis film tearing machine is used to remove the protective tape on the surface of wafers after thinning or etching processes. The device can be used for film tearing on 4 ", 5", 6 ", 8", and 12 "wafers. -
Wafer Frame Film Mounter Semiconductor Film Mounting MachineManual film tearing machine, suitable for tearing 6-inch small flat edge SIC wafer film. The main body of the machine is made of stainless steel and aluminum alloy, with stable performance and simple operation. -
Customized Semi-automatic Wafer Expander Machine Manual Silicon Die Matrix ExpanderThe equipment is suitable for industries such as IC, Dior, Transistor, Glass, LED, QFN, PCB, etc., and is suitable for expansion or stretching processes after cutting processes in the production of semiconductor integrated circuit chips. -
8inch 12inch Semi-automatic Semiconductor Wafer Expander Cutting Expanding MachineCommon uses of wafer expansion machines: Wafer expander machine are also known as chip expansion machines or expansion machines. Widely used in the grain expansion process in the production of light-emitting diodes, small and medium power transistors, backlights, LEDs, integrated circuits, and some special semiconductor devices. For example, in the LED industry, the grain expander evenly separates tightly packed LED chips to better implant them onto the welded workpiece. It utilizes the heating plasticity of LED film and adopts dual cylinder up and down control to evenly spread a single LED chip in all directions, achieving satisfactory chip gaps and automatically forming the film without deformation. Thermostatic design ceramic plate, easy to operate and understand. -
8inch Semi-automatic LED Semiconductor Wafer Expander Expansion MachineStandard 8inch Wafer Expander For LED Semiconductor Chip, 7-inch touch screen, By adopting an imported PLC control system, Flip cover automatic locking device -
6 inch Manual Wafer Expander Die Matrix ExpanderApplied to light-emitting diodes, small and medium power transistors, backlight sources, LEDs, integrated circuits and some special semiconductor devices -
Semiconductor Wafer Cleaving Machine GPP Wafer Laser CuttingSemiautomatic Semiconductor Wafer Breaker is controlled by PLC, replaces the manual use of roller cleaving action. -
UVV Ultraviolet measurement instrumentUltravioletMeasurement Professional Wavelength UVV Intensity Meter Detection 395nm, 405nm, 445nm Power Range 1-3000mW cm²
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