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uvcure@uvspacelight.com
live:1651063690jennifer
+8618924372460
0086-18924372460
Shenzhen Deshengxing Electronics Co., Ltd.

New Products

12 inch Semi-automatic Film Wafer Laminating Machine
The 12 Inch Semi-automatic Film Wafer Laminating Machine featuresheight adjustment, table heating, vacuum adsorption, and automatic film sticking, ensuring precise and stable lamination for semiconductor wafers. Its advanced design improves lamination accuracy and production efficiency while maintaining consistent performance. Withover 2000 successful cases, the machine has proven reliability and is widely trusted in wafer processing applications.
Custom Wafer Expander With the SameSize Grip Ring
Small Wafer Nitrogen UV Curing System Tape LED UV Curing Box
Nitrogen UV Curing System Tape Led,Compact and Practical UV Curing system, 5 seconds for The Film to Detach from The Wafer, Adjustable Time, Adjustable illumination, Nitrogen Protection
Wafer UV Curing System LED Tape UV Curing Machine Semiconductor Ceramic Substrate Square
Illumination can be adjusted, Time can be adjusted, Even Curing, 5 seconds Curing,Compatible with multiple sizes
6 inch 8 inch Semi-automatic LED Wafer Expander Machine
Equipped with nitrogen support rod, clamshell labor-saving function; Adjust the height of the working plate to rise, you can adjust the spacing between the DIE; Using the motor lifting and cylinder lifting to complete the membrane expansion process, to ensure the consistency of the membrane expansion;

Customized Semi-automatic Wafer Expander Machine Manual Silicon Die Matrix Expander

Customized Semi-automatic Wafer Expander Machine Manual Silicon Die Matrix Expander

The equipment is suitable for industries such as IC, Dior, Transistor, Glass, LED, QFN, PCB, etc., and is suitable for expansion or stretching processes after cutting processes in the production of semiconductor integrated circuit chips.

Brand:
DSXUV
port of dispatch :
Shenzhen
Payment :
T/T 100% before shipment
original region :
China
Lead Time :
15-25days

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Product Details

1. Function:
After the cutting process in the production of semiconductor integrated circuit chips, the film attached to the back of the cut/segmented chip is fixed with an expansion ring, and the film is uniformly expanded in the X-Y direction by the rise of the worktable, thereby driving the chip to expand to any interval, greatly facilitating the processing after the chip cutting/segmentation process.

2. Principle:
A wafer expander is a device used to uniformly stretch the film after the cutting process, thereby separating the cut chips and evenly pulling them apart at a certain distance. The expansion method adopts servo motor, and the expansion height and speed can be parameterized in the configured touch screen.

3. Purpose:
After the cutting process of semiconductor integrated circuit chips from wafers, the gaps between chips are very small, which can cause collisions and edge breakage between chips, resulting in waste.
The film expander can simply and quickly expand the cut chips in the X-Y direction, uniformly increasing the spacing between chips to the desired size, separating chips, avoiding chip to chip collision damage, and obtaining intact integrated circuit chips. The workbench design with heating and adjustable temperature can improve the expansion effect and greatly increase the expansion height to meet different customer needs. The height of the expansion film can be adjusted. The speed of the protective film can be adjusted. The workbench temperature is adjustable.

customized wafer expander