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uvcure@uvspacelight.com
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Guangdong Spacelight Technology Co., Ltd.

New Products

Custom 4-inch Wafer Film & Gold Layer Peeling Machine
Custom 4-inch Wafer Film & Gold Layer Peeling Machine is designed for precise and efficient wafer film and gold layer peeling, featuring stable operation and high processing accuracy for semiconductor applications. We support OEM/ODM customization and tailored machine solutions according to different production requirements, helping customers improve efficiency and maintain consistent product quality.
12 inch Semi-automatic Film Wafer Laminating Machine
The 12 Inch Semi-automatic Film Wafer Laminating Machine featuresheight adjustment, table heating, vacuum adsorption, and automatic film sticking, ensuring precise and stable lamination for semiconductor wafers. Its advanced design improves lamination accuracy and production efficiency while maintaining consistent performance. Withover 2000 successful cases, the machine has proven reliability and is widely trusted in wafer processing applications.
Custom Wafer Expander With the SameSize Grip Ring
Small Wafer Nitrogen UV Curing System Tape LED UV Curing Box
Nitrogen UV Curing System Tape Led,Compact and Practical UV Curing system, 5 seconds for The Film to Detach from The Wafer, Adjustable Time, Adjustable illumination, Nitrogen Protection
Wafer UV Curing System LED Tape UV Curing Machine Semiconductor Ceramic Substrate Square
Illumination can be adjusted, Time can be adjusted, Even Curing, 5 seconds Curing,Compatible with multiple sizes

Chip Film Transfer Molding Machine

Chip inversion machine can be used to transfer wafers from one film to another (such as UV film, blue film, optical film, etc.). This can be used to manufacture devices with specific functions, such as optical devices, sensors, and microelectronic components

model no. :
DSX-new model
port of dispatch :
Shenzhen
Payment :
T/T 100% before shipment
original region :
China
Lead Time :
10-15days

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Product Details

Parameters:
Model: DXSUV Chip Inverter
Method: Electric controlled servo motor
Compression stroke: 120mm+10mm
Heating system: Temperature controlled heating, heating range 0-70 degrees Celsius
Air pressure: 0.6-0.8Mpa
Total power: 950W
Machine voltage: 220V
Adsorption method: Vacuum adsorption
Film release method: manual
Product placement method: manual
Reverse molding machine Size

The purpose of chip inversion machine:

Packaging: In the process of chip manufacturing, a chip inversion machine can place a wafer containing completed chips onto the packaging layer (usually adhesive and packaging materials). This can protect the chip and provide electrical and mechanical connections.

Reverse molding machine

Thin film transfer:

Chip inversion machines can be used to transfer wafers from one film to another (e.g. UV film, blue film, optical film, etc.). This can be used to manufacture devices with specific functions. Such as optical devices, sensors, and microelectronic components

Flip machine

Reverse molding machine casting

Flip packaging:

In some advanced packaging technologies, a chip inversion machine can be used to invert the chip and package it in a specific position on another film. This method can achieve cleaning of products, thereby improving chip performance.

Inverted explanation