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  • LED UV Curing Box
    Small Wafer Nitrogen UV Curing System Tape LED UV Curing Box

    Nitrogen UV Curing System Tape Led,Compact and Practical UV Curing system, 5 seconds for The Film to Detach from The Wafer, Adjustable Time, Adjustable illumination, Nitrogen Protection

  • UV Curing System
    Wafer UV Curing System LED Tape UV Curing Machine Semiconductor Ceramic Substrate Square

    Illumination can be adjusted, Time can be adjusted, Even Curing, 5 seconds Curing,Compatible with multiple sizes

  • Wafer Expander Machine
    6 inch 8 inch Semi-automatic LED Wafer Expander Machine

    Equipped with nitrogen support rod, clamshell labor-saving function; Adjust the height of the working plate to rise, you can adjust the spacing between the DIE; Using the motor lifting and cylinder lifting to complete the membrane expansion process, to ensure the consistency of the membrane expansion;

  • Semi-automatic Wafer Mounter Machine
    DSXUV 12inch Semi-automatic Wafer Mounter Film Sticking Machine

    This equipment (lamator) is mainly used for 12 inch Si wafer BG film coating. No burrs, no bubbles. The wafer type is dummy wafer. This semi-automatic film sticking machine is suitable for applying film to products such as wafers, semiconductors, ceramics, and glass. It is a device used for film coating processing, specifically designed to precisely adhere thin film materials to the surface of wafers. It combines the characteristics of manual operation and automatic control, providing higher film application accuracy and efficiency while maintaining operational convenience.

  • Manual wafer tearing machine
    Manual Wafer Film Separator Silicon Stripping Machine

    This film tearing machine is used to remove the protective tape on the surface of wafers after thinning or etching processes. The device can be used for film tearing on 4 ", 5", 6 ", 8", and 12 "wafers.

8inch 12inch Semi-automatic Semiconductor Wafer Expander Cutting Expanding Machine 8inch 12inch Semi-automatic Semiconductor Wafer Expander Cutting Expanding Machine 8inch 12inch Semi-automatic Semiconductor Wafer Expander Cutting Expanding Machine

8inch 12inch Semi-automatic Semiconductor Wafer Expander Cutting Expanding Machine

Common uses of wafer expansion machines: Wafer expander machine are also known as chip expansion machines or expansion machines. Widely used in the grain expansion process in the production of light-emitting diodes, small and medium power transistors, backlights, LEDs, integrated circuits, and some special semiconductor devices. For example, in the LED industry, the grain expander evenly separates tightly packed LED chips to better implant them onto the welded workpiece. It utilizes the heating plasticity of LED film and adopts dual cylinder up and down control to evenly spread a single LED chip in all directions, achieving satisfactory chip gaps and automatically forming the film without deformation. Thermostatic design ceramic plate, easy to operate and understand.
  • Brand:

    DSXUV
  • port of dispatch :

    Shenzhen
  • Payment :

    T/T 100% before shipment
  • original region :

    China
  • Lead Time :

    15-20days
Product Details

Principle:

A wafer expander is a device used to uniformly stretch the film after the cutting process, thereby separating the cut chips and evenly pulling them apart at a certain distance. The expansion method adopts servo motor, and the expansion height and speed can be parameterized in the configured touch screen.

There are various names for wafer expansion machines:
Expanding machines, LED expanding machines, LED expanding machines, grain expanding machines, wafer expanding machines, expanding ring expanding machines, plastic ring expanding machines, chip expanding machines, chip expanding machines, 6-inch expanding machines, 8-inch expanding machines, 10 inch expanding machines, 12 inch expanding machines, semi-automatic wafer expanding machines, manual expanding machines.

expander wafer
wafer cutting image

 2. Purpose:
 After the cutting process of semiconductor integrated circuit chips from wafers, the gaps between chips are very small, which can cause collisions and edge breakage between chips, resulting in waste.
The film expander can simply and quickly expand the cut chips in the X-Y direction, uniformly increasing the spacing between chips to the desired size, separating chips, avoiding chip to chip collision damage, and obtaining intact integrated circuit chips. The workbench design with heating and adjustable temperature can improve the expansion effect and greatly increase the expansion height to meet different customer needs. The height of the expansion film can be adjusted. The speed of the protective film can be adjusted. The workbench temperature is adjustable.
 
3. Application areas:

The wafer expansion equipment is suitable for industries such as IC, Dior, Transistor, Glass, LED, QFN, PCB, etc. It is suitable for the expansion or stretching process after the cutting process in the production of semiconductor integrated circuit chips.

The wafer expansion machine series products are specifically designed for the expansion process after cutting wafers, LEDs, etc., equipped with imported guide rails, temperature control systems, and can evenly expand the spacing between grains. The current models of wafer expansion machines include 6-inch expansion machines, 8-inch expansion machines, 10 inch expansion machines, 12 inch expansion machines, semi-automatic wafer expansion machines, and manual expansion machines

2、 Main features of this machine:
The main body is made of stainless steel and aluminum alloy, with reliable quality and stable performance;
High and stable expansion accuracy;
➢ Easy to operate, easy to understand and master;

The appearance of this machine is beautiful, sturdy and reliable, with superior performance and affordable price, which can greatly improve production efficiency for customers.



Parameters:
Rated voltage: AC 220V
2 Frequency: 50/60HZ
3 Power: < 400W
4 Air pressure: 0.5~0.6Mpa
5. Machine weight: 50kg
6 types of adhesive film: PVC material film
7. Film thickness: 0.05~0.2mm
Heating temperature for 8 plates: 0-80 ℃
9. Membrane expansion function: semi-automatic
10 film cutting function: automatic film cutting

Product advantages:
 1. Automatic film cutting, efficient output;
 2. The speed and travel can be precisely controlled;
 3. Electric expansion film, uniform and flat;
 4. Adopting dual cylinder up and down control; Adjustable next station travel;
 5. Heating, stretching, crystal expansion, and film solidification are completed in one go;
GET STARTED

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