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Manual 6 inch Wafer Laminating Machine Wafer Mounter Substrate Heated ChuckFilm laminating machine designed for wafer, glass, LED, PCB, and ceramic cutting processes, Microporous table, Teflon Surface, Small Size, Roller Pressure, Multifilm Application, No particles, No fragments. -
6 inch 8 inch Semi-automatic LED Wafer Expander MachineEquipped with nitrogen support rod, clamshell labor-saving function; Adjust the height of the working plate to rise, you can adjust the spacing between the DIE; Using the motor lifting and cylinder lifting to complete the membrane expansion process, to ensure the consistency of the membrane expansion; -
3 4 6 8inch Manual Wafer Laminating Machine Wafer Mounter SystemWafer Laminating Machine 8-inch Compatible Pre Cutting Laminating Without Bubble Vacuum Adsorption, Suitable for various blue and UV films, No bubbles (excluding broken bubbles), Have Temperature Controller for Heated Chucks and Vacuum Pump. -
DSXUV Fiberglass PO Material 8ich 9inch Wafer Expander Film Frame Hoop Ring Shipper225mm 241mm Fiberglass PO material Wafer Expander Film Frame Hoop Ring Expandtion Expandtion iron ring, This Product Has Multiple Names: Wafer Hoop Ring, Expanded Crystal Ring, Plastic Ring, Hoop Ring, Stretch Ring, Expanded Film Ring. -
TAIKO 12inch Semi-automatic Wafer Laminating Machine UV Film Sticking Machine12inch Semi-automatic Wafer Laminating Machine, Wafer Mounter Laminating Without Bubbles or Burrs,UV Film Laminating Machine. Semi-automatic Film Sticking Machine Improves Production Efficiency and Reduces Labor Costs. -
4 Inch Wafer Iron Hoop Wafer Frame Ring for UV LED Wafer Mounter4 inch Iron Ring Wafer Frame is strong hardness, resistance to bending, good stickiness and durability, widely used in semiconductor packaging, film, cutting, adhesive process bearing appliances. -
DSXUV 12inch Semi-automatic Wafer Mounter Film Sticking MachineThis equipment (lamator) is mainly used for 12 inch Si wafer BG film coating. No burrs, no bubbles. The wafer type is dummy wafer. This semi-automatic film sticking machine is suitable for applying film to products such as wafers, semiconductors, ceramics, and glass. It is a device used for film coating processing, specifically designed to precisely adhere thin film materials to the surface of wafers. It combines the characteristics of manual operation and automatic control, providing higher film application accuracy and efficiency while maintaining operational convenience. -
Chip Film Transfer Molding MachineChip inversion machine can be used to transfer wafers from one film to another (such as UV film, blue film, optical film, etc.). This can be used to manufacture devices with specific functions, such as optical devices, sensors, and microelectronic components -
NICHIA 405nm UV LED NCSU035D Ultraviolet Light Chips SMD UV LED Light BeadsJapan NICHIA 405nm UV LED Lights is 6868 Flat Window 120 degree quartz glass encapsulation, 3D Printer Curing Lamp,NCSU035C is no longer produced The new model is NCSU035D -
Manual Wafer Film Separator Silicon Stripping MachineThis film tearing machine is used to remove the protective tape on the surface of wafers after thinning or etching processes. The device can be used for film tearing on 4 ", 5", 6 ", 8", and 12 "wafers. -
Wafer Frame Film Mounter Semiconductor Film Mounting MachineManual film tearing machine, suitable for tearing 6-inch small flat edge SIC wafer film. The main body of the machine is made of stainless steel and aluminum alloy, with stable performance and simple operation. -
Customized Semi-automatic Wafer Expander Machine Manual Silicon Die Matrix ExpanderThe equipment is suitable for industries such as IC, Dior, Transistor, Glass, LED, QFN, PCB, etc., and is suitable for expansion or stretching processes after cutting processes in the production of semiconductor integrated circuit chips.
+8618924372460
live:1651063690jennifer
uvcure@uvspacelight.com
0086-18924372460