12inch Wafer Film UV Curing Systems is widely used in degumming wafers, like silicon wafers, glass and semiconductor components.
model no. :
Wafer Film UV Curing SystemsBrand:
DSXUVport of dispatch :
ShenzhenPayment :
T/T 100% before shipmentoriginal region :
China12inch Wafer Film UV Curing Systems is widely used in degumming wafers, like silicon wafers, glass and semiconductor components. Perfect match with the sealing field of the cutting, grinding, thinning process.
Parameters:
Model |
DSXUV-Tape-12 |
Manufacturer |
Shenzhen desheng xing Electronics Co., LTD |
Outside Dimension |
L460.5*W490*H628mm |
Capacity of the drawer |
L380mm*W380mm*H7mm |
Cool method |
Air cooled |
Input power |
100-240V AC 50-60HZ |
Total power |
1800W |
Wavelength |
SVC UV LED 365nm |
Compatibility size |
12" and under |
Illuminance |
>600mW/cm² |
Display/language |
Touch screen English |
Function |
Adjustable time and illumination |
Material/Weight |
White sheet metal/bare metal 55kg including 60kg wooden case |
Irradiation direction |
To the bottom up |
Characteristics:
1.Adopt imported SVC UVLED lights, scientific array arrangement, the uniformity of 95%.
2.When the degumming is finished, there will be a hint light. Red: A fault occurs. Yellow: Waiting to run. Green: It is running.
3.Touch screen operating system, easy to operate.
4.Compatible with multiple size of wafer iron rings. The 12 inch UV Wafer Tape Curing Systems is compatible with 6/8/12 inch wafers and small sizes. Support the cutting process of degumming, grinding degumming, thinning degumming.
6 inches Wafer Expander Rings is used for semiconductor packaging, film, cutting, adhesive process bearing appliances.
Stainless Steel 12'' Iron Ring Wafer Frame is strong hardness, resistance to bending, good stickiness, durability.
The selection material of Stainless Steel Wafer Iron Rings is through SGS certification, high bending strength, high hardness, can bear high load, high wear, corrosive media.
Curing multiple 6 inches UV Wafer at the same time, UV Film Tape Curing Systems reduce the adhesive strength of all UV-sensitive dicing tapes under controlled environment.
Professional Manufacturing UV Wafer Tape Curing Machine is low calorie, good bonding performance, fast speed, environmental protection equipment.
Adhesive strength becomes lower when UV(Ultraviolet light) is irradiated by UV Tape UV Curing Systems.