12 inch Wafer Tape Degumming Machine is suitable for degumming wafer, silicon wafer, glass, semiconductor components and other products.
model no. :
Nitrogen Type UV Curing SystemBrand:
DSXUVport of dispatch :
ShenzhenPayment :
T/T 100% before shipmentoriginal region :
ChinaStandard 12 inch Wafer Film UV Degumming Machine is suitable for degumming wafer, silicon wafer, glass, semiconductor components and other products. Perfect match with the sealing field of cutting, grinding, thinning process.
Information:
Name: Nitrogen UV Tape UV Curing Systems
Type: DSXUV-TapeN-12
Light source: SVC UV LED
Cooling Method: Fan cooling
Outside Dimension: L532*W552*H675mm
Use for Wafer Iron Ring: 12 inch and below
Operation: Touch screen operating
Gross weight: 75KG, including package
Characteristic: Nitrogen protection, real-time illumination monitoring
6 inches Wafer Expander Rings is used for semiconductor packaging, film, cutting, adhesive process bearing appliances.
Stainless Steel 12'' Iron Ring Wafer Frame is strong hardness, resistance to bending, good stickiness, durability.
The selection material of Stainless Steel Wafer Iron Rings is through SGS certification, high bending strength, high hardness, can bear high load, high wear, corrosive media.
Curing multiple 6 inches UV Wafer at the same time, UV Film Tape Curing Systems reduce the adhesive strength of all UV-sensitive dicing tapes under controlled environment.
Professional Manufacturing UV Wafer Tape Curing Machine is low calorie, good bonding performance, fast speed, environmental protection equipment.
Adhesive strength becomes lower when UV(Ultraviolet light) is irradiated by UV Tape UV Curing Systems.