model no. :
Wafer Tape Curing EquipmentBrand:
DSXUVport of dispatch :
ShenzhenPayment :
T/T 100% before shipmentoriginal region :
ChinaStandard 8inch Wafer Processing Systems is widely used in semiconductor industry. It is often used to reduce the viscosity of the UV film/tape and facilitate the next operation of the wafer.
Parameters:
Dimension |
L428*W422*H280 mm |
Manufacturer |
Shenzhen Deshengxing Electronics Co., Ltd. |
Cooling |
Air cooling |
Input Power |
100-240V AC 50-60 HZ |
Material |
White sheet metal |
Compatible with the size |
8 inches and under |
Size of drawer |
L350*W350*H23 mm |
Display and Operation |
Touch screen display,PLC, English |
Set the Lock |
Changeable password |
Weight |
40kg |
Intensity |
>600mW/cm2 |
Total Power |
1000W |
Fixture Size |
8 inch |
Recommend highly |
10~15mm |
Cooling |
Air cooling |
Wavelength |
365nm |
Function |
Adjustable time and intensity |
Irradiation direction |
From bottom to top |
Usage: |
Reduce the viscosity of UV film, convenient for the next step. |
Characteristics of Semiconductor UV Tape Curing Machine :
1.Small body, suitable for 4/6/8 inch chip irradiation.
2.Time and brightness adjustable, touch screen operation, simple and convenient.
3.Bottom up irradiation for easy placement of wafers.
4.LED clod light source, environmental protection products, with low temperature, uniform exposure, compact structure, low energy consumption, is the ideal type of semiconductor industry, and low temperature no damage to thermal sensitive materials.
5.Its service life is 10 times longer than that of ordinary mercury lamp. Its continuous service life is 20000h.
6.Zero maintenance cost, long-term work without replacement of lighting source parts.
7.Enclosed light source design, no ultraviolet side leakage, no damage to human body.
6 inches Wafer Expander Rings is used for semiconductor packaging, film, cutting, adhesive process bearing appliances.
Stainless Steel 12'' Iron Ring Wafer Frame is strong hardness, resistance to bending, good stickiness, durability.
The selection material of Stainless Steel Wafer Iron Rings is through SGS certification, high bending strength, high hardness, can bear high load, high wear, corrosive media.
Curing multiple 6 inches UV Wafer at the same time, UV Film Tape Curing Systems reduce the adhesive strength of all UV-sensitive dicing tapes under controlled environment.
Professional Manufacturing UV Wafer Tape Curing Machine is low calorie, good bonding performance, fast speed, environmental protection equipment.
Adhesive strength becomes lower when UV(Ultraviolet light) is irradiated by UV Tape UV Curing Systems.