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12 inch Semi-automatic Film Wafer Laminating Machine 12 inch Semi-automatic Film Wafer Laminating Machine 12 inch Semi-automatic Film Wafer Laminating Machine

12 inch Semi-automatic Film Wafer Laminating Machine

The 12 Inch Semi-automatic Film Wafer Laminating Machine featuresheight adjustment, table heating, vacuum adsorption, and automatic film sticking, ensuring precise and stable lamination for semiconductor wafers. Its advanced design improves lamination accuracy and production efficiency while maintaining consistent performance. Withover 2000 successful cases, the machine has proven reliability and is widely trusted in wafer processing applications.


  • model no. :

    DSXUV-SEMI12
  • Color :

    White
  • port of dispatch :

    Shenzhen
  • Payment :

    100% T/T before shipping
  • original region :

    China
  • Lead Time :

    15days
Product Details

12 inch Semi-automatic Film Wafer Laminating Machine


The 12 inch semi-automatic wafer laminating machine is designed for precise film lamination in semiconductor wafer processing. Suitable for semiconduct or wafer thinning applications, this chip wafer laminating equipment supports wafers with a thickness of 180–600 μmand features anadjustable tray heightto accommodate different processing requirements. With stable operation and accurate lamination performance, it helps improve efficiency and ensure reliable results in wafer manufacturing processes.


Product Name:

Product name:

Wafer Film Coating Machine

Wafer size:

12 inch & 8 inch

Color:

white

Model:

DSXUV-SEMI12

Weight:

180kg

Rated voltage:

AC220V

Frequency

50/60HZ

Power:

600W

Air pressure:

0.5-0.8Pma

Film thickness:

0.05-0.18mm

Heating temperature:

0-100 degrees Celsius

Film pulling function:

automatic film cutting

Wafer thickness:

100-800um

Fragmentation rate:

one in ten thousand

WPH

> 60S

Size:

LWH1464X650X497mm

Film requirements:

no fragments, no particles, no wrinkles, no bubbles

Voltage:

Match with customer country

Chuck Height:

Adjustable

Roller pressure:

Adjustable


Advantages of wafer laminating machine

Machine Features:

1. Disk temperature should be at least>50 degrees

2. The chuck temperature can be heated to at least 95 degrees Celsius

3. 360 degree wafer edge without burrs

4. The film is flat without bubbles

5. Vacuum adsorption function of the tray

6. 12 inch standard size chuck

7. Black microporous Teflon coating on the tabletop

8. Adjustable roller pressure

9. The height of the chuck can be adjusted

10. Maximum membrane saving


Application of wafer laminating machine


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