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uvcure@uvspacelight.com
live:1651063690jennifer
+8618924372460
0086-18924372460
Shenzhen Deshengxing Electronics Co., Ltd.

New Products

Small Wafer Nitrogen UV Curing System Tape LED UV Curing Box
Nitrogen UV Curing System Tape Led,Compact and Practical UV Curing system, 5 seconds for The Film to Detach from The Wafer, Adjustable Time, Adjustable illumination, Nitrogen Protection
Wafer UV Curing System LED Tape UV Curing Machine Semiconductor Ceramic Substrate Square
Illumination can be adjusted, Time can be adjusted, Even Curing, 5 seconds Curing,Compatible with multiple sizes
6 inch 8 inch Semi-automatic LED Wafer Expander Machine
Equipped with nitrogen support rod, clamshell labor-saving function; Adjust the height of the working plate to rise, you can adjust the spacing between the DIE; Using the motor lifting and cylinder lifting to complete the membrane expansion process, to ensure the consistency of the membrane expansion;
DSXUV 12inch Semi-automatic Wafer Mounter Film Sticking Machine
This equipment (lamator) is mainly used for 12 inch Si wafer BG film coating. No burrs, no bubbles. The wafer type is dummy wafer. This semi-automatic film sticking machine is suitable for applying film to products such as wafers, semiconductors, ceramics, and glass. It is a device used for film coating processing, specifically designed to precisely adhere thin film materials to the surface of wafers. It combines the characteristics of manual operation and automatic control, providing higher film application accuracy and efficiency while maintaining operational convenience.
Manual Wafer Film Separator Silicon Stripping Machine
This film tearing machine is used to remove the protective tape on the surface of wafers after thinning or etching processes. The device can be used for film tearing on 4 ", 5", 6 ", 8", and 12 "wafers.

Automatic Wafer Mounter Laminating Machine Ceramic Substrate Glass Film Laminator Machine

Fully Automatic Wafer Laminating Machine,Efficient Automatic Glass Laminating Machine, Automatic Positioning ,Automatic Film , Pulling Automatic ,Cutting Adjustable Speed

Brand:
DSXUV
port of dispatch :
Shenzhen
Payment :
100% T/T before shipment
original region :
China
Lead Time :
15days

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Product Details

Fully Automatic Wafer Laminating Machine Customized Wafer Mounter Machine for Chip Production Line
Material: Mirror aluminum alloy

Rated voltage: AC220V

Frequency: 50/60Hz

Power: 500W

Air pressure: 0.5-0.8Mpa

Machine weight: 200kg

Type: Blue film, UV film

Thickness: 0.08-0.16mm

Heating temperature of the table: 0-100 degrees Celsius

Pull film function: automatic

Film function: automatic

Film cutting method: automatic film cutting

Product thickness: 100-200um

Wafer size: non-standard size

Fragmentation rate: one in ten thousand

WPH > 60PCS

Film requirements: no fragments, no particles, no defects

Machine size: 1735 * 860 * 2150mm

wafer mounter machine

Anti static PTFE surface treatment film table with heating function and elasticity:

The table design with heating and adjustable heating temperature range ensures that the adhesive effect of the film can be adjusted to the ideal state.

The elastic platform can adapt to wafers, glass, or ceramics of different thicknesses.

The surface anti-static PTFE treatment not only reduces the static electricity generated during film application, but also effectively prevents physical scratches on the chip.