Automatic Wafer Mounter Laminating Machine Ceramic Substrate Glass Film Laminator Machine

Fully Automatic Wafer Laminating Machine Customized Wafer Mounter Machine for Chip Production Line
Material: Mirror aluminum alloy

Rated voltage: AC220V

Frequency: 50/60Hz

Power: 500W

Air pressure: 0.5-0.8Mpa

Machine weight: 200kg

Type: Blue film, UV film

Thickness: 0.08-0.16mm

Heating temperature of the table: 0-100 degrees Celsius

Pull film function: automatic

Film function: automatic

Film cutting method: automatic film cutting

Product thickness: 100-200um

Wafer size: non-standard size

Fragmentation rate: one in ten thousand

WPH > 60PCS

Film requirements: no fragments, no particles, no defects

Machine size: 1735 * 860 * 2150mm

Anti static PTFE surface treatment film table with heating function and elasticity:

The table design with heating and adjustable heating temperature range ensures that the adhesive effect of the film can be adjusted to the ideal state.

The elastic platform can adapt to wafers, glass, or ceramics of different thicknesses.

The surface anti-static PTFE treatment not only reduces the static electricity generated during film application, but also effectively prevents physical scratches on the chip.

Main functions:

1. Suitable for blue film, UV film, PET substrate film, and double-layer film.

2. Optional microporous film coating tray that can be applied to ultra-thin wafers.

3. The heated and elastic film coating tray design can adapt to wafers of different thicknesses.

4. Film roller pressure adjustable design.

5. Equipped with a circular knife and a cross cutting knife.

6. Optional ion air rod electrostatic removal device.

7. Small size, desktop placement type.