4 inch 6 inch 8inch Compatible Wafer Laminating Machine Gringding Wafer Mounter Machine

4 inch 6 inch 8inch Compatible Wafer Laminating Machine Gringding Wafer Mounter Machine

Specially designed for wafers, glass, LED， Film laminating machine for semiconductor integrated circuit and ceramic substrate design.

Round cut film with smooth edges, no burrs, and no residual film. The Teflon vacuum small hole adsorption platform reduces film stress and prevents product damage

Advantages:

1- Adapt to wafers of different thicknesses: Designed with a heated and elastic film coating platform to accommodate wafers of different thicknesses

2-- The pressure of the film roller can be adjusted according to the requirements of the customer's product

3-- Protect the wafer, equipped with anti-static Teflon working disc and heating function

4- Efficient and stable, the equipment is designed with a floating worktable and precision guide rod to ensure stability and accuracy during the film application process. At the same time, the roller pressure can be adjusted to adapt to products of different thicknesses

5- Multifunctional, some manual wafer laminating machines have automatic circular trajectory cutting of adhesive film, plasma electrostatic function, etc., ensuring that the laminating is smooth and free of burrs and bubbles