Grinding Wafer Mounter Machine Wafer Table Top Laminator Tool

The contact surface is coated with anti-static PTFE, effectively protecting the chip

Advantages and Quality Assurance:

1,Design to save UV film

2,Micropore Chuck

3,Iron Buddha Dragon Surface

4,Small Size

5,Adjustable Roller Pressure

6,Suitable for multiple types of films

Product Efficacy:

1,Compatibility: One body, compatible with cutting and grinding film functions

2,Heated and elastic film chuck design, suitable for wafers of different thicknesses

3,The pressure of the film roller can be adjusted to meet different film application needs

4,Equipped with circular and cross cutting knives for easy cutting and organization

5,Ionic air rod static removal device can be optionally selected to ensure no bubbles, smooth and burr free effect during the film application process

6,Teflon coated CHUCK ensures smooth film pulling without sticking

7,Vacuum adsorption system for tighter product adhesion

8,Micro porous design tray ensures vacuum adsorption function

9,The film is guaranteed to be bubble free, residue free, edge free, and wrinkle free

Wide Ring of Application：

1,Vacuum adsorption: Micro porous vacuum adsorption Chuck

2,Temperature controller: used to set the heating temperature

3,Vacuum gauge: table vacuum pressure gauge

4,Mode knob: For example, 6-inch 8-inch mode switch

5,Timer: Record the number of rotations of the circular cutter

6,Spring seat: cushion bounce of the chuck

7,Vacuum switch: Press the suction table chip to secure it firmly

8,Recycling roller: Recycling of release layer

9,Tray: Place SIC wafers (surface Teflon)

10,Side door: convenient for maintenance and film replacement

11,Film release roller: placement and fixation of film

12,Technical alarm: When the timer reaches the set value, the alarm will sound

13,Back cover: protection for the film placement area, can be opened and closed, convenient for operation and maintenance

14,Film roller: Roll the film to make it flat, wrinkle free, and bubble free

15,Cutting handle: ring cutting with a ring cutter

Product advantages and features:

Suitable for wafers of different thicknesses: The heated and elastic film design can adapt to wafers of different thicknesses

Adjustable pressure of film roller: The pressure of the film roller can be adjusted according to the requirements of the customer's product

Static electricity removal device: An ion air rod static electricity removal device can be optionally selected to ensure effective resolution of static electricity issues during the film application process

Easy to operate: Manual wafer laminating machines usually have automatic film pulling and laminating functions, reducing the complexity of manual operation and ensuring safe operation

Protecting wafers: Equipped with anti-static Teflon treated work plates and heating functions, it can effectively protect wafers from static electricity and damage

Efficient and stable: The equipment is designed with a floating worktable and precision guide rods to ensure stability and accuracy during the film application process. At the same time, the roller pressure can be adjusted, suitable for products of different thicknesses

Multifunctionality: Some manual wafer laminating machines also have automatic circular trajectory cutting of adhesive film, plasma anti-static function, etc., ensuring that the laminating film is smooth and free of burrs and bubbles

Wafer Laminating Machine and UV Curing System Certificate