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  • LED UV Curing Box
    Small Wafer Nitrogen UV Curing System Tape LED UV Curing Box

    Nitrogen UV Curing System Tape Led,Compact and Practical UV Curing system, 5 seconds for The Film to Detach from The Wafer, Adjustable Time, Adjustable illumination, Nitrogen Protection

  • UV Curing System
    Wafer UV Curing System LED Tape UV Curing Machine Semiconductor Ceramic Substrate Square

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  • Wafer Expander Machine
    6 inch 8 inch Semi-automatic LED Wafer Expander Machine

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  • Semi-automatic Wafer Mounter Machine
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    This equipment (lamator) is mainly used for 12 inch Si wafer BG film coating. No burrs, no bubbles. The wafer type is dummy wafer. This semi-automatic film sticking machine is suitable for applying film to products such as wafers, semiconductors, ceramics, and glass. It is a device used for film coating processing, specifically designed to precisely adhere thin film materials to the surface of wafers. It combines the characteristics of manual operation and automatic control, providing higher film application accuracy and efficiency while maintaining operational convenience.

  • Manual wafer tearing machine
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    This film tearing machine is used to remove the protective tape on the surface of wafers after thinning or etching processes. The device can be used for film tearing on 4 ", 5", 6 ", 8", and 12 "wafers.

Quartz Lens View Angle deg 30° UV LED for Printing Curing 365nm 395nm Quartz Lens View Angle deg 30° UV LED for Printing Curing 365nm 395nm Quartz Lens View Angle deg 30° UV LED for Printing Curing 365nm 395nm Quartz Lens View Angle deg 30° UV LED for Printing Curing 365nm 395nm Quartz Lens View Angle deg 30° UV LED for Printing Curing 365nm 395nm

Quartz Lens View Angle deg 30° UV LED for Printing Curing 365nm 395nm

The application of Quartz Lens View Angle deg 30° UV LED for Printing Curing Wavelenth 365-415nm is for UV Curing.

  • model no. :

    Quartz Encapsulates UVLED Lamp
  • Brand:

    DSXUV
  • port of dispatch :

    SHENZHEN
  • Payment :

    T/T
  • original region :

    CHINA
  • Lead Time :

    The Same Day
Product Details

Quartz Lens View Angle deg 30° UV LED for Printing Curing Wavelenth 365-415nm is made of high-end packaging material Quartz High End Material Package, aluminium nitride substrate, Taiwan Liansheng 46MIL jumbo size chip,  and 99.99% pure gold line.


Features:

1. Emitted Color: White.

2. Lens Appearance: Clean quartz lens

3. 3.45x3.45x3.30mm standard package.

4. Suitable for all SMT assembly methods.

5. Compatible with infrared and vapor phase reflow solder process.

6. Compatible with automatic placement equipment.

7. This product doesn’t contain restriction Substance, comply ROHS standard.


 Violet Quartz Encapsulates Lamp

Quartz Lens


Judgment Criteria ofFfailure for the Reliability

Quartz UV LED

Note: 

1. U means the upper limit of specified characteristics. S means initial value.

2. After each test, remove test pieces, wait for 2 hours and test pieces have returned to ambient
temperature, then take next measurement.


Lens handling

Please follow the guideline to grab LEDs
1. Use tweezers to grab LEDs
2. Do not touch lens with the tweezers
3. Do not touch lens with fingers
4. Do not apply more than 4N of lens (400g) directly onto the lens
View Angle deg 30° UV LED


Lens cleaning

In the case where a minimal level of dirt and dust particles can not be guaranteed, a suitable cleaning solution can be applied to the lens surface

1. Try a gentle swabbing using a lint-free swab

2. If needed, the use of lint-free swab and isopropyl alcohol used gently removes dirt from the lens surface

3. Do not use other solvents as they may directly react with the LED assembly

4. Do not use ultrasonic cleaning that the LED will be damaged


Carrier Tape Handling

The following items are recommended when handling the Carrier tape of LEDs

1. Do not twist the carrier tape

2. The inward bending diameter should not smaller than 6cm for carrier tape.

3. Do not bend the tape outward.

4. Storage temperature should not exceed 60℃

UV LED for Printing Curing Wavelenth 365-415nm


Handling :

Care must be taken not to damage LED’s silicon while exposing to high temperature or contact LED’s epoxy resin with hard or sharp objects, such as metal hook, tweezer or sand blasting.


Notes for designing:

Current limiting resistor must be used in the circuit to drive LEDs within the rated figures and not to overload LEDs with instantaneous voltage at the turning ON and OFF cycles.

When using pulse driving, the average current must be within the rated figures. And the circuit should be designed to avoid reverse voltage when turning off the LEDs.


Storage:

In order to avoid the absorption of moisture, it is recommended to solder LEDs as soon as possible after unpacking the sealed envelope.

If the envelope is still packed, to store it in the environment as following:

(1) Temperature : 5℃-30℃(41℉)Humidity : RH 60﹪Max.

(2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or equivalent soldering process must be:

a. Completed within 168 hours.

b. Stored at less than 30% RH.

(3) Devices require baking before mounting, if: (2) a or (2) b is not met.

(4) If baking is required, devices must be baked under below conditions: 48 hours at 60℃±3℃.

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