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Manual Glass Wafer Laminator 8" Dicing Tape Mounter8 inch manual wafer mounter, heated vacuum wafer mounter, vacuum adsorption glass laminator, 0-120℃ wafer film mounting machine, desktop wafer mounter DSX-26-088, manual dicing film laminator for glass substrate -
10 Inch N2 Nitrogen UV Debonding Machine, Semiconductor Wafer UV Tape Degumming Equipment With Touch Screen & Alarm Function365nm UV LED Nitrogen Debonding Equipment,For 10 Inch Frame Nitrogen UV Debonding Machine Multi-Size Wafer UV Tape Curing Machine.N2 Filled UV Debonder Machine, Industrial Wafer UV Film Removing Oven For Semiconductor Dicing Process. -
Semi Automatic Wafer Mounter For 10" FrameA wafer mounter (or frame film mounter) is a semiconductor fabrication tool used to securely attach a silicon or compound wafer onto a dicing frame using specialized adhesive tape. This prepares the wafer for the dicing (sawing) process by keeping the fragile die in place after they are cut. DSXUV26-051 this semi aoto wafer mouter is for 10" frame and 6"wafer. -
Semi Automatic Wafer Tape Expander for 10inch FrameThis semi-automatic wafer expanding machine (MODEL :DSX26-052) is designed to expand die grains mounted on a 10-inch Frame ring and transfer them onto an 8-inch Frame ring. -
8 Inch Manual Wafer Expander DSX-20-1008 Inch Manual Wafer Expander DSXUVEPMANUL8 Semiconductor Dicing Film Stretching Machine for 10 Inch Grip Ring -
NWSU333B 385NM, Original Genuine NICHIA Made in Japan, Ready Stock AvailableNWSU333B 385NM, Original Genuine NICHIA Made in Japan, Ready Stock Available -
NCSU434D NICHIA 280nm UVC LEDNICHIA NCSU434D UVC LED 280nm 3535 High Power LED Chip 5.14W Disinfection Air Purification Surface Curing Light Source -
Custom 4-inch Wafer Film & Gold Layer Peeling MachineCustom 4-inch Wafer Film & Gold Layer Peeling Machine is designed for precise and efficient wafer film and gold layer peeling, featuring stable operation and high processing accuracy for semiconductor applications. We support OEM/ODM customization and tailored machine solutions according to different production requirements, helping customers improve efficiency and maintain consistent product quality. -
12 inch Semi-automatic Film Wafer Laminating MachineThe 12 Inch Semi-automatic Film Wafer Laminating Machine featuresheight adjustment, table heating, vacuum adsorption, and automatic film sticking, ensuring precise and stable lamination for semiconductor wafers. Its advanced design improves lamination accuracy and production efficiency while maintaining consistent performance. Withover 2000 successful cases, the machine has proven reliability and is widely trusted in wafer processing applications. -
Small Wafer Nitrogen UV Curing System Tape LED UV Curing BoxNitrogen UV Curing System Tape Led,Compact and Practical UV Curing system, 5 seconds for The Film to Detach from The Wafer, Adjustable Time, Adjustable illumination, Nitrogen Protection -
Wafer UV Curing System LED Tape UV Curing Machine Semiconductor Ceramic Substrate SquareIllumination can be adjusted, Time can be adjusted, Even Curing, 5 seconds Curing,Compatible with multiple sizes

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