Semi‑automatic wafer mounter compatible with 6",8",12" wafer & electronic glass. Supports blue film & UV film lamination & peeling. Heated vacuum platen, high accuracy, low breakage rate, >60 PCS per hour for semiconductor thinning process.

Black anti-static teflon chuck, The height of chuck can be adjusted, and products with a thickness of 150-750um can be attached, No bubbles, No wrinkles, Easy to operate,Accept customization

8 inch manual wafer mounter, heated vacuum wafer mounter, vacuum adsorption glass laminator, 0-120℃ wafer film mounting machine, desktop wafer mounter DSX-26-088, manual dicing film laminator for glass substrate

365nm UV LED Nitrogen Debonding Equipment，For 10 Inch Frame Nitrogen UV Debonding Machine Multi-Size Wafer UV Tape Curing Machine.N2 Filled UV Debonder Machine, Industrial Wafer UV Film Removing Oven For Semiconductor Dicing Process.

A wafer mounter (or frame film mounter) is a semiconductor fabrication tool used to securely attach a silicon or compound wafer onto a dicing frame using specialized adhesive tape. This prepares the wafer for the dicing (sawing) process by keeping the fragile die in place after they are cut. DSXUV26-051 this semi aoto wafer mouter is for 10" frame and 6"wafer.