DSXUV 6 inch Frame Film Manual Wafer Tearing Film Machine With Ceramic Chuck

DSXUV 6 inch Frame Film Manual Wafer Tearing Film Machine With Ceramic Chuck

6-inch Wafer Film Tearing Machine, Ceramic Disc Vacuum Adsorption Laboratory, Small Semiconductor Packaging Film Tearing Equipment

The main features of the manual 6-inch wafer tearing machine can be summarized as follows:

1. Ionic fan: used to eliminate static electricity, prevent the wafer surface from adsorbing dust or film debris, and ensure the cleanliness of the film tearing process.

2. Ceramic tray: Provides a flat, high-temperature resistant, and corrosion-resistant working platform to protect wafers from damage during the film tearing process.

3. Temperature control switch and temperature control display: It can achieve temperature adjustment and real-time monitoring, adapt to the temperature requirements of different film materials, and improve the quality of film tearing.

4. Vacuum display and vacuum switch: The wafer is fixed by vacuum adsorption to ensure its stable position and safe and reliable operation during the film tearing process.

5. Power switch: controls the power on and off of equipment to ensure safe operation.

6. Manual operation mode: suitable for small batches or experimental environments, flexible operation, and relatively low cost.

Application area:

1)Semiconductor Manufacturing and Packaging

2)advanced packaging

3)Optoelectronics and Display Field

4)For Electronic Mechanical Systems and Research

5)Solar photovoltaic field