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High Power UV-LED NVSU333A U365nm 18.9W 3640mW/cm2 High Power UV-LED NVSU333A U365nm 18.9W 3640mW/cm2 High Power UV-LED NVSU333A U365nm 18.9W 3640mW/cm2 High Power UV-LED NVSU333A U365nm 18.9W 3640mW/cm2 High Power UV-LED NVSU333A U365nm 18.9W 3640mW/cm2

High Power UV-LED NVSU333A U365nm 18.9W 3640mW/cm2

NVSU333A UV-LED had been chosen by demanding customers that require rigorous quality such as high precision curing, ink curing (printing), bill checker etc. It's also the best way to solidify UV glue.


  • model no. :

    NVSU333A365nm
  • Brand:

    UV-LED CURING
  • Color :

    yellow
  • port of dispatch :

    HongKong
  • Payment :

    T/T
  • original region :

    Japan
  • Lead Time :

    7days
Product Details

NVSU333A 365nm  ,"World Standard" High Power UV-LED,Long lifetime

NVSU333A 365nm UV LED

Main parameter

● Pb-free Reflow Soldering Application

● Built-in ESD Protection Device
● RoHS Compliant


NVSU333ASPECIFICATIONS:

(1) Absolute Maximum Ratings

Forward Current  I F 4500  mA

Pulse Forward Current  I FP 6000  mA
Allowable Reverse Current  I R 85  mA
Power Dissipation  P D 18.9  W
Operating Temperature  T opr -10~85  °C
Storage Temperature  T stg -40~100  °C
Junction Temperature  T J 100  °C
* Absolute Maximum Ratings at T S =25°C.
* I FP conditions with pulse width ≤10ms and duty cycle ≤10%.


UV-LED NVSU333A U365nm 18.9W 3640mW/cm2(2) Initial Electrical/Optical Characteristics
Forward Voltage  V F I F =3500mA  3.85V
Radiant Flux  Φ e I F =3500mA  3640mW
Peak Wavelength  λ p I F =3500mA  365nm
Spectrum Half Width  Δλ  I F =3500mA  9.0nm

* Characteristics at T S =25°C.
* Radiant Flux value as per CIE 127:2007 standard.
* R θJS is the thermal resistance from the junction to the T S measurement point.
* It is recommended to operate the LEDs at a current greater than 10% of the sorting current to stabilize the LED characteristics.


UV-LED NVSU333A U365nm

(3)Size
LxWxH(mm) 6.8x6.8x1.9

UV LED NICHIA 365nm

(4)NVSU333A Applications

Ink curing ,Lithography,Resin curing,Fluorescence Excitation,UV glue curing,Gap bonding,Magnetic-particle inspection etc.


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