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High Power 6'' 8'' 12'' UV Wafer Tape Curing Systems Curing Semiconductor High Power 6'' 8'' 12'' UV Wafer Tape Curing Systems Curing Semiconductor High Power 6'' 8'' 12'' UV Wafer Tape Curing Systems Curing Semiconductor High Power 6'' 8'' 12'' UV Wafer Tape Curing Systems Curing Semiconductor

High Power 6'' 8'' 12'' UV Wafer Tape Curing Systems Curing Semiconductor

UV Wafer Tape Curing System solves the curing process of wafer, glass and ceramic cutting technology, which is not only limited to semiconductor packaging industry, but also applicable to UV film curing of optical lens, LED, IC, semiconductor, integrated circuit board, mobile hard disk and other semiconductor materials.

  • model no. :

    UV Wafer Curing Equipment
  • Brand:

    DSXUV
  • port of dispatch :

    Shenzhen
  • Payment :

    T/T 100% Before Shipment
  • original region :

    China
Product Details

In the semiconductor chip production process, the wafer shall be fixed on the frame with the wafer film before the chip scribing. After the scribing process is completed, LED UV light is used to illuminate the fixed film to make the UV film viscous curing and hardening, so as to reduce the viscosity of the scribing fixed film and facilitate the smooth production of the subsequent packaging process. In other words, UV tape has a strong adhesive strength that will hold the wafer firmly during the wafer grinding or cutting process. When the ultraviolet radiation, the bonding strength becomes low. As a result, the wafer or chip can easily peel off the adhesive tape after being exposed to ultraviolet light. UV Wafer Tape Curing System solves the curing process of wafer, glass and ceramic cutting technology, which is not only limited to semiconductor packaging industry, but also applicable to UV film curing of optical lens, LED, IC, semiconductor, integrated circuit board, mobile hard disk and other semiconductor materials. UV mercury lamp is commonly used in existing UV curing machines, but the mercury lamp light source with high heat emission is easy to damage thermal sensitive materials, with low efficiency and difficult to accurately control the quality standard, which is not suitable for the irradiation of high precision devices such as chips. The environmentally friendly low temperature LED UV light source curing machine adopted by Shenzhen Deshengxing Electronics Co., Ltd. can easily finish the UV film curing process without damaging the wafer, which can greatly meet the production requirements.


Parameters of Large UV LED Exposure Machine

Sell Offers UV LED Exposure Equipment for Wafers from China

Host Size of UV Curing Light Chamber

L320*W384*H246.8mm

Weight

6.5kg

Cooling

Air cooling

Input Power

100-240V AC 50-60 HZ

Material

White sheet metal 

Drive the Number of Luminous Heads

A light source

Craft

Stoving varnish

Display and Operation

Touch screen display, adjustable time, illumination

Set the Lock

Changeable password

LED Time Accumulation Function

Actively record cumulative usage time


Sell Offers UV LED Exposure Equipment for Exposure Manufacturers


Luminous Dimension of UV LED Exposure Equipment

Diameter : 150mm

Total Power

350W

Fixture Size

5.9 inch

Recommend highly

10~15mm

Cooling

Air cooling

Wavelength

Default 365nm, customizable  385 / 395 / 405

Illuminance

300-2000mW/cm2

Light Source Predicts Service Life

20000 H


Characteristics of Semiconductor UV Tape Curing Machine :

1.Small body, suitable for 6/8/12/15 inch chip irradiation.

2.Time and brightness adjustable, touch screen operation, simple and convenient.

3.Bottom up irradiation for easy placement of wafers.

4.LED clod light source, environmental protection products, with low temperature, uniform exposure, compact structure, low energy consumption, is the ideal type of semiconductor industry, and low temperature no damage to thermal sensitive materials.

5.Its service life is 10 times longer than that of ordinary mercury lamp. Its continuous service life is 15000-30000h.

6.Zero maintenance cost, long-term work without replacement of lighting source parts.

7.Enclosed light source design, no ultraviolet side leakage, no damage to human body.


No.

Content

Parameters

1

Wafer size

6”   81012‘’  (multiple specifications are available)

2

Light area

Φ150mm, Φ200mm, Φ300mm

3

Nominal voltage

AC 110/220V

4

Frequency

50/60HZ

5

Rated power

350-900W

6

Wavelength of UV Light

365nm-415nm selectablenormal 365nm

7

Dimension L*W*H

320mm×384mm×247mm

(size customizable)

8

Machine weight

6.5kg

9

Film type

UV film  all kinds of UV Tape

10

Thickness of the film

0.152mm

11

Irradiation direction

Bottom up exposure

12

Operating mode

Touch screen operation

13

Timer setting time

Unlimited, adjustable (unit : s)

14

Completion time of curing

Depending on UV tape characteristics (minimum 5s)

15

Exposure intensity setting

20% ~ 100%, adjustable brightness

16

System fittings

Customized according to customer requirements.  Default 5.9 inch.

Please contact us for more details : uvcure@uvspacelight.com (Jennifer)


UV Film Viscosity Remover Machine

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You can contact us any way that is convenient for you. We are available 24/7 via, email or telephone.

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