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Shenzhen Deshengxing Electronics Co., Ltd.

New Products

Small Wafer Nitrogen UV Curing System Tape LED UV Curing Box
Nitrogen UV Curing System Tape Led,Compact and Practical UV Curing system, 5 seconds for The Film to Detach from The Wafer, Adjustable Time, Adjustable illumination, Nitrogen Protection
Wafer UV Curing System LED Tape UV Curing Machine Semiconductor Ceramic Substrate Square
Illumination can be adjusted, Time can be adjusted, Even Curing, 5 seconds Curing,Compatible with multiple sizes
6 inch 8 inch Semi-automatic LED Wafer Expander Machine
Equipped with nitrogen support rod, clamshell labor-saving function; Adjust the height of the working plate to rise, you can adjust the spacing between the DIE; Using the motor lifting and cylinder lifting to complete the membrane expansion process, to ensure the consistency of the membrane expansion;
DSXUV 12inch Semi-automatic Wafer Mounter Film Sticking Machine
This equipment (lamator) is mainly used for 12 inch Si wafer BG film coating. No burrs, no bubbles. The wafer type is dummy wafer. This semi-automatic film sticking machine is suitable for applying film to products such as wafers, semiconductors, ceramics, and glass. It is a device used for film coating processing, specifically designed to precisely adhere thin film materials to the surface of wafers. It combines the characteristics of manual operation and automatic control, providing higher film application accuracy and efficiency while maintaining operational convenience.
Manual Wafer Film Separator Silicon Stripping Machine
This film tearing machine is used to remove the protective tape on the surface of wafers after thinning or etching processes. The device can be used for film tearing on 4 ", 5", 6 ", 8", and 12 "wafers.

High Intensity UV LED Modules Chip 31×30mm UV LED COB DOB

High Intensity UV LED Modules Chip 31×30mm UV LED COB DOB

UV LED Modules Chip is high intensity and high power. It is equipped with numbers of lights.

model no. :
High Intensity UV LED Modules Chip
Brand:
DSXUV
port of dispatch :
SHENZHEN
Payment :
T/T
original region :
CHINA

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Product Details

UV LED Modules Chip, high intensity and high power, is equipped with numbers of lights.

Key Features of Customized UV LED Module :

- Best thermally conductive substrates: thick film silver layer on aluminum nitride, or DBC (directed

bonded copper) on aluminum nitride that enable the high-power density;

- Eutectic soldering process instead of silver epoxy for die attach, improving thermal conductivity;

- “Known Good Die”, good brand of UV chips that have been tested reliable with good statistics;

four wavelength ranges: 360 - 370nm; 380 – 390nm; 390 – 400nm; 400 – 410nm.

- Thermally stable and UV stable silicone for encapsulation that were selected based on extensive

experimental test data;

- Long history on packaging UV light source with rich experience and lessons.

Part Number Specification of Replaceable UV LED Modules Chip 365-395nm :

Part number	Wavelength range (nm)
MLUV64-360	360-370
MLUV64-380	380-390
MLUV64-390	390-400
MLUV64-400	400-410

Absolute Maximum Rating of High Intensity Ultraviolet LED Chip Curing UV Ink :

DC forward current (A)
MLUV64-360	5.6 (0.7 per channel)
MLUV64-380	10.0 (1.25 per channel)
MLUV64-390	10.0 (1.25 per channel)
MLUV64-400	10.0 (1.25 per channel)
Power consumption (W)
MLUV64-360	162 (2.5W per chip)
MLUV64-380	295 (4.6W per chip)
MLUV64-390	295 (4.6W per chip)
MLUV64-400	295 (4.6W per chip
LED junction temperature (°C)	130
Operating ambient temperature (°C)	50

Mechanical Dimension of High Performance UV LED Chip :

Dimension (mm x mm x mm)	46.0 x 32.6 x 3.0
Emitting area (mm x mm)	31.7 x 30.3

High Intensity UV LED Modules Chip

Electrical Characteristics of UV LED Chip LED Module for UV Curing Systems :

8 lines, each line has 8 LED chips connected in series; 8 lines are divided in 2 groups, each group has 4 lines;

the 4 lines in each group are connected in parallel at the ends.

UV LED Lights

Forward current (A)	Typical	Maximum
MLUV64-360		5.6 (0.7 per channel)
MLUV64-380	5.6 (0.7 per channel)	10.0 (1.25 per channel)
MLUV64-390	5.6 (0.7 per channel)	10.0 (1.25 per channel)
MLUV64-400	5.6 (0.7 per channel)	10.0 (1.25 per channel)
Forward voltage range (V)	Typical	Maximum
MLUV64-360		28.8 - 32.8 (3.6 - 4.1 for a die)
MLUV64-380	27.2 - 29.2 (3.4 - 3.65 for a die)	29.2 - 32.4 (3.65 - 4.05 for a die)
MLUV64-390	27.2 - 29.2 (3.4 - 3.65 for a die)	29.2 - 32.4 (3.65 - 4.05 for a die)
MLUV64-400	27.2 - 29.2 (3.4 - 3.65 for a die)	29.2 - 32.4 (3.65 - 4.05 for a die)
Power consumption range (watt)	Typical	Maximum
MLUV64-360		160 - 186 (2.5 - 2.9 for a die)
MLUV64-380	152 - 163 (2.38 - 2.55 for a die)	294 - 326 (4.6 - 5.1 for a die)
MLUV64-390	152 - 163 (2.38 - 2.55 for a die)	294 - 326 (4.6 - 5.1 for a die)
MLUV64-400	152 - 163 (2.38 - 2.55 for a die)	294 - 326 (4.6 - 5.1 for a die)
Connector 1
Connector 2

Optical Performance of Customized UV LED Chip 365-405nm :

Part Number	Peak wavelength range (nm), @25°C, @3.5A (0.7A per channel, note 1
MLUV64-360	360 - 370
MLUV64-380	380 - 390
MLUV64-390	390 - 400
MLUV64-400	400 - 410
FWHM (nm)	15

Radiant flux (W), @25°C, @3.5A (0.7A per channel)	Min.	Max.
MLUV64-360	51 (0.8W per die)	64 (1W per die)
MLUV64-380	64 (1W per die)	77 (1.2W per die)
MLUV64-390	64 (1W per die)	77 (1.2W per die)
MLUV64-400	64 (1W per die)	77 (1.2W per die)
Radiant flux (W), @25°C, @3.5A (0.7A per channel)	Min.	Max.
MLUV64-360	74 (1.16W per die)	95 (1.48W per die)
MLUV64-380	92 (1.44 per die)	113 (1.76W per die)
MLUV64-390	92 (1.44 per die)	113 (1.76W per die)
MLUV64-400	92 (1.44 per die)	113 (1.76W per die)

Notes: The peak wavelength is measured with an accuracy of ±1nm

Thermal Performance of Low Temperature UV Light Source Module Curing UV Coating :

Thermal Resistance (°C / W)

0.08

Cautions of Industrial Specialized UV Light Module :

UV LIGHT These devices are ultraviolet LEDs. During operation, the LED emits high intensity ultraviolet (UV) light, which is harmful to skin and eyes.

UV light is hazardous to skin and may cause cancer. Avoid exposure to UV light when LED is operational.

Precautions must be taken to avoid looking directly at the UV light without the use of UV light protective glasses. Do not look directly at the front of the LED or at the LED’s lens when LED is operational.

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