The 12 Inch Semi-automatic Film Wafer Laminating Machine featuresheight adjustment, table heating, vacuum adsorption, and automatic film sticking, ensuring precise and stable lamination for semiconductor wafers. Its advanced design improves lamination accuracy and production efficiency while maintaining consistent performance. Withover 2000 successful cases, the machine has proven reliability and is widely trusted in wafer processing applications.

Nitrogen UV Curing System Tape Led,Compact and Practical UV Curing system, 5 seconds for The Film to Detach from The Wafer, Adjustable Time, Adjustable illumination, Nitrogen Protection

Illumination can be adjusted, Time can be adjusted, Even Curing, 5 seconds Curing,Compatible with multiple sizes

Equipped with nitrogen support rod, clamshell labor-saving function; Adjust the height of the working plate to rise, you can adjust the spacing between the DIE; Using the motor lifting and cylinder lifting to complete the membrane expansion process, to ensure the consistency of the membrane expansion;