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15W Korea LG Four LED Chips UV Flashlight UV LED Light Beads 365nm 15W Korea LG Four LED Chips UV Flashlight UV LED Light Beads 365nm

15W Korea LG Four LED Chips UV Flashlight UV LED Light Beads 365nm

Korea LG Four Chips 365nm UV LED Light Beads is encapsulated quartz glass lens, with newly developed ultra-high quartz glass lens + ceramic packaging technology.

  • model no. :

    15W Four Chips UV LED Light
  • Brand:

    LG
  • port of dispatch :

    SHENZHEN
  • Payment :

    T/T 100% Before Shipment
  • original region :

    CHINA
Product Details

Korea LG Four Chips 365nm UV LED Light Beads is encapsulated quartz glass lens. In the encapsulation technology, the lamp bead encapsulated with four chips is not suitable for silicone lens, which is easy to be yellow and fall off, and the light fades quickly.


LG UV LED Curing LED Chip, Newly developed ultra-high quartz glass lens + ceramic packaging technology, small angle light design, packaging size of 7070, silicon-based UV LED emitting high purity purple light, high current resistance, low thermal resistance, etc.


Suitable for : electronic offset printing (adhesive curing), ceramic and metal painting glazing, fiber drawing, printing, ink printing and other curing application market.


Product Feature :

Ceramic substrate seal

ESD protective

Support Surface Mount Technology (SMT)

Size : 7.0*7.0 mm


Typical Optical Power :

385nm  4200mW @1500mA 

395nm  4400mW @1500mA 

( Maximum allowable working current : IF max= :2000mA )

Chip type : 55 mil silicon vertical LED chip

Send light angle : 68°


Application :

banknote inspection, mosquito control, manicure, industrial curing


Characteristic Parameters : (T solder pad = 25 ℃)

Characteristic

Symbol

Minimum Value

Typical Value

Maximum Value

Unit

Test Condition

Optical Power (385)

e

4000

4200

5000

mW

IF=1500mA & 25

Optical Power (395)

e

4000

4400

5000

mW

Forward Voltage

VF

3

-

3.8

V

Direct Current

IF

-

1500

2000

mA

Backward Voltage

VR

 

 

5

V

Wavelength

WLR

365

 

405

nm

Irradiation Angle

2θ1/2

-

68

-

°

Thermal Resistance

 

 

2.5

 

/ W

HBM

ESD

 

8000

 

V

T j (Junction Temperature)

T j

 

 

125

Note :

1.When the lamp bead is normally lit, the maximum allowable current is IFMAX = 200mA

2.The lamp bead test data is obtained by UV integrating ball test in cold pulse mode.

3.For lamp bead module products, the maximum temperature TC of PCB board shall not exceed 90℃. (protect chip junction temperature T j≤125℃)

4.The recommended current of this product is IF=500mA, mainly used for curing class light mode for customers.


Optical Power Parameter : (T solder pad = 25 ℃)

Wavelength

Wavelength Range

Optical Power

Test Condition

Minimum

Maximum

Grading

Optical Power mW

UV Wavelength

380

405

KM

4000-5000

IF=1500Ma & 25

Note : optical power test error : ±8%

Product coding rules :

VG-P5-KM-TD

Example : the rank of peak wavelength is P5. It means that the peak wavelength range is 380-385nm.


Voltage Step :

Rank

 Minimum

Maximum

Test Condition

TD

6.5

7.5

T solder pad = 25


Step Size :

1. Peak wavelength grading

Rank

Minimum

Maximum

Test Condition

P1

400

405

T solder pad = 25

IF = 1000mA

P2

395

400

P3

390

395

P4

385

390

P5

380

385

Note : peak wavelength test error : ±1.5nm.


2. Optical Power Grading

Rank

Minimum

Maximum

Test Condition

KM

4000

5000

T solder pad = 25

IF = 1000mA

Note : Luminance test error : ±8%.


Korea LG Deep UV Light for UV Flashlight


Deep UV Light Source LED Chips


High Uniformity 15W UV LED Light


Korea 365nm LED Light UV LED Beads


High Power LED UV Device


Precautions for use

How to store Korea LG UV LED ?

1. The product should be stored in an environment with a dry, relative humidity of less than 30% and a storage temperature of 5 to 30 °C. 

2. Avoid external damage to the vacuum bag to prevent the bag from leaking and getting wet. 

3. Pay attention to moisture. If it is damp, put the patch reel in a 60 °C oven for 24 hours; remove the tape from the bag, preferably within 12 hours 

4. LED lights that have been unsealed from the original packaging but have not been soldered should be stored in one of the following ways: 

a. After opening, the LED lights can be resealed in the original vacuum bag. 

b. Store the parts in a sturdy metal container with a tight lid attached. Place the fresh desiccant and humidity card in a container and check that the relative  humidity is less than 30%. 

c. Store the parts in a dry, nitrogen-purified cabinet or container and require the cabinet or container to effectively maintain the relative humidity below 30%. 

d. After reopening, the reflow soldering is completed within 24 hours. The workshop condition is ≤30°C/60%RH. 

e. If there is no environment with a relative humidity below 30% for storage, one hour before reflow, it must be baked. 

5. When stacking PCBs or components that contain LEDs, do not drop all weight on the lens. The force applied to the lens can cause the lens to fall off. 

A clearance of at least 2 cm should be left above the LED lens, and the foamed wrapping paper should not be used directly on the lamp. The force from the foamed packaging can damage the LED 


reflow soldering conditions 

1. The printed circuit board should be prepared or cleaned in accordance with the manufacturer's specifications before the LEDs can be placed or soldered onto the PCB. 

2. Our company's LEDs are designed to be soldered to the PCB by reflow soldering. Reflow soldering can be done in a reflow oven or by placing the PCB on a hot plate and 

following the reflow profile.

3. Pay attention to the reflow conditions when using, and reflow soldering after debugging the reflow temperature. Reflow conditions: preheating temperature 100 ~ 150 ℃; reflow 

soldering temperature of 230 ~ 260 ℃, the welding time of 10 seconds.Operators should take electrostatic protection measures and all equipment must be grounded reliably. 

4. Reflow soldering should not exceed 2 times at most. 

5. Do not apply pressure to the lamp bead when passing the lamp. 

6. After the lamp is over, the PCB board cannot be packaged immediately. The PCB board and the lamp bead should be naturally cooled. 


Cleaning 

after reflow soldering 1. After soldering, the lamp bead should be cooled to room temperature for further processing. Premature handling of the device, especially around the lens, can result in product damage. 

2. It is recommended to check the weld consistency. After avoiding the selected parts of the board, the welding process should be able to achieve complete look at reflux (no clear 

significant weld particles). From the back of the package and board, there should be almost no holes visible in the soldered area. 

3. When cleaning the PCB after soldering, use isopropyl alcohol to clean the PCB. Do not use ultrasonic cleaning. Do not use water to clean PCB boards that have been fitted with lamp beads. 

4. Do not use the following chemicals for cleaning: chemicals that 

may cause outgassing of aromatic hydrocarbon compounds (eg toluene, xylene) 

a. methyl acetate or ethyl acetate (ie: nail polish cleaner) 

b. cyanoacrylate Ester (ie: 

superglue ) c. Ethylene glycol (including Radio Shack® precision electronic cleaner) 

d.PLIOBOND® adhesive      


Installation method 

1. High Intensity UV LED Chip has anti-static requirements, and appropriate anti-static measures should be taken during installation and use. 

2. Pay attention to the arrangement of the external lines of various devices to prevent the polarity from being wrong. The device must not be too close to the heating element and the operating conditions should not exceed the specified limits. 

3. When deciding to install in the hole, calculate the hole size and tolerance of the hole on the board to avoid excessive pressure on the board. 

4. Avoid subjecting the LED to any vibration and external forces. 


Operating conditions 

1. In order for the LED to operate under stable conditions, a series of protective resistors must be connected in series, and the resistance value can be measured by the supply voltage or current of the LED. LED work 

for the voltage and current given by a variety of product specifications requirements LED. 

2. The circuit must be designed to prevent overvoltage (or overcurrent) that can occur during LED switching. Short current or pulse current can damage the LED connections. 

3. When the Fiber Drawing UV Curing UV Light LED light source is working, the ambient temperature will affect its life reliability. Please keep away from the heat source while working, and the surface temperature should be controlled within 60 °C 

 


. 4. Incompatible volatile organic compounds in the LED-based solid-state lighting design. , may weaken the performance of the illumination system, shorten its 

life, so avoid the use of organic compounds in the design and operation. 


Other matters 

1. This product is a silicone package and cannot be extruded with a hard object. 

2. All equipment that touches the LED must be grounded. Operators must wear grounded anti-static gloves, anti-static shoes and anti-static clothing.

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