12 inches Wafer Frame Dicing Cutting Ring Round Fixed Silicon Disk Iron Ring For Wafer Blue Film

Stainless Steel 12’’ Wafer Ring Metal Film Frame is selection of materials through SGS certification, high bending strength, high hardness, can bear high load, high wear, corrosive media. 12 inches Blue Film Attachment Wafer Iron Ring is with strong hardness, resistance to bending, good stickiness, durability.

Product information for Stainless Steel Wafer Frame Rings :

Brand : DSXUV

Name : wafer frame ring

No. : DSMTQE12-000-R0

Material : SUS420j2 (stainless steel)

Specification : 12 inches (OD 379.8*380.4mm, ID R177.6mm)

Application : it can be widely used in semiconductor wafer packaging, film coating, cutting, solid crystal and other processes in electronics factory.

Product features of Semiconductor Wafer Ring Metal Frame :

1. Heat treatment process of selected raw material

SUS420J2 imported material, with good corrosion resistance, heat resistance. The product has good resistance to rebound after heat treatment.

2. Surface electropolishing treatment

The surface is polished, the surface flatness can reach above ±0.01mm, the finish RX value can reach above 0.08um, can keep clean and beautiful for a long time.

3. Laser cutting with high accuracy

Advanced laser cutting machine is with high cutting accuracy, shape tolerance according to GB/T1184-K, size tolerance according to GB/T1804-M standard processing molding.

Applications of 12’’ Disco Stainless Steel Wafer Iron Ring :

Bearing silicon wafers used in semiconductor packaging or LED packaging process : film/wafer mount, grinding/back grinding, cutting/die saw, bonding(solid crystal)/die attach, turnaround transport and other processes.