12 inch Semi-Automatic Wafer Expansion Machine Semi Auto Wafer Expander System

The Advantages of This Semi-automatic Film Wafer Expander System

1). The height and speed of the expansion film can be set through touch screen digital settings:

2). The worktable has a constant temperature heating function, which helps with the extensibility of the film;

3). Adjust the height of the work disk to adjust the spacing between grain DIEs:

4). Equipped with a serrated ring cutter for quick film cutting;

5) Equipped with safety barriers to reduce safety hazards;

6) Touchscreen display parameters, execution steps, and fault alarms

7) Using motor lifting and cylinder lifting to complete the film expansion process, ensuring consistency of film expansion;

8). Using imported PLC as the control system, functions such as preheating delay and film expansion delay for the platform rise can be set to better improve the quality of film expansion.

Function of our Wafer Expander Machine

1-Can achieve expansion of iron rings and be compatible with products without iron rings for film expansion:

2-Can activate the button with both hands for protection;

3-Install safety grating for safety protection;

4-It can achieve a 1-second fast film cutting function;

5-Install protective devices for protection;

6-The cutting blade is not a special product and is easy to install

7-Requirements for parameter performance indicators

8-Name: Expansion and Cutting Machine Model: DSXUV-WE12

9-Equipment size L712XW620XH1100mm

10-Adapt to product sizes below 12 inches for wafers

11-The size of the iron ring is 12 inches, and the iron ring is compatible without an iron ring

Positioning infrared positioning

12-Hoop Ring Size: Outer Ring: 345mm, Inner Ring: 325mm, Thickness: 7mm

Power 500W

13-Rated voltage AC220V frequency 50/60HZ