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New Products
  • LED UV Curing Box
    Small Wafer Nitrogen UV Curing System Tape LED UV Curing Box

    Nitrogen UV Curing System Tape Led,Compact and Practical UV Curing system, 5 seconds for The Film to Detach from The Wafer, Adjustable Time, Adjustable illumination, Nitrogen Protection

  • UV Curing System
    Wafer UV Curing System LED Tape UV Curing Machine Semiconductor Ceramic Substrate Square

    Illumination can be adjusted, Time can be adjusted, Even Curing, 5 seconds Curing,Compatible with multiple sizes

  • Wafer Expander Machine
    6 inch 8 inch Semi-automatic LED Wafer Expander Machine

    Equipped with nitrogen support rod, clamshell labor-saving function; Adjust the height of the working plate to rise, you can adjust the spacing between the DIE; Using the motor lifting and cylinder lifting to complete the membrane expansion process, to ensure the consistency of the membrane expansion;

  • Semi-automatic Wafer Mounter Machine
    DSXUV 12inch Semi-automatic Wafer Mounter Film Sticking Machine

    This equipment (lamator) is mainly used for 12 inch Si wafer BG film coating. No burrs, no bubbles. The wafer type is dummy wafer. This semi-automatic film sticking machine is suitable for applying film to products such as wafers, semiconductors, ceramics, and glass. It is a device used for film coating processing, specifically designed to precisely adhere thin film materials to the surface of wafers. It combines the characteristics of manual operation and automatic control, providing higher film application accuracy and efficiency while maintaining operational convenience.

  • Manual wafer tearing machine
    Manual Wafer Film Separator Silicon Stripping Machine

    This film tearing machine is used to remove the protective tape on the surface of wafers after thinning or etching processes. The device can be used for film tearing on 4 ", 5", 6 ", 8", and 12 "wafers.

What is UV Film? UV Adhesive Principle

2021-04-30 16:15:17

UV film is a special formula UV coating on coated PET, P0, PVC, EVA film base material surface, is a specially designed for semiconductor chips, special optical glass (wafer of silicon, filter glass), special metal and ceramic substrates and flexible electronics and some small thin fragile parts processing production of fixed, protection, bearing with designed a new type of adhesive products. This material adopts specially polyolefin (PO) and polyester (PET) film as raw material, coated with special adhesive, through dust-free high temperature coating process. UV film with high adhesion, high tensile strength, adaptability, balanced extension and other characteristics, easy to fix some small particles or fragile ultra-thin sheet, so that the material in the grinding, processing and cutting process does not slide, do not fly, no water seepage. At the end of the processing, the UV film after a specific ultraviolet energy irradiation to make the tape lose adhesion, it is easy to separate the product from the tape, and no damage, no residue, very good to meet the semiconductor and optical industry special materials processing process. UV tape can be customized according to customer requirements of various thickness, viscosity and processing customer required shape and size. The principle of UV adhesive is mainly concentrated in the adhesive formula to add a photo-initiator, so that it in a specific value of UV LED light curing, trigger the internal function, making the original high adhesive surface suddenly lose viscosity, so as to meet the requirements of the process.


Customized Blue Film Wafer Chips Expanding Rings


LED UV Tape Curing Systems for UV Wafer Semiconductor

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